Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are interested in statistical analysis of volumes of high-quality diagnosis results to determine yield limiters. To be of value for both engineers, a diagnosis tool needs to be
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MEMS Need Comprehensive, Market-Ready SolutionsMicroelectromechanical systems -- commonly known as MEMS -- applications are on the rise. In fact, the MEMS market is currently outpacing overall IC market growth at a rate that is twice as fast and is expected to be a $20B US market as early as 2017. Why the uptick in MEMS use? The consumer (primarily handheld) and automotive markets hold the answer for now, but other market sectors such as me... July 19, 2013
Sponsored by Henkel Corporation
Rapid Defect Indentification with Layout-Aware DiagnosisScan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are interested in statistical analysis of volumes of high-quality diagnosis results to determine yield limiters. To be of value for both engineers, a diagnosis tool needs to be Accurate, With high resolution and Meaningful defect classificati... April 05, 2013
Sponsored by Mentor Graphics, Silicon Test and Yield Analysis Division
Surface Cleaning and PreparationMay 16, 2013
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process steps. An additional challenge is that the reduction in device size and an increase in device topography makes the removal of small particles even more challenging.
450mm Status ReportApril 03, 2013
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business development director, Lode Lauwers, on why 450mm is important for Europe, and the status of 450mm research on processes and devices.
Tackling Design for Yield Questions at DAC
IFTLE 152 2013 IMAPS Device Packaging Conference part 2 
Economy Threatens Semi Growth, not Technology – so Say Fab Engineers at ASMC
Who's Driving the MEMS Evolution Revolution Now? (Part 3 of 3)
2013 International Workshop on EUVL: Maui, Hawaii, June 10-14, 2013