EDITORS' PICKS


Toshiba brings civil suit against SK Hynix
03/14/2014Toshiba Corporation announced that it has brought a civil suit against Korea’s SK Hynix Inc. at the Tokyo District Court, under Japan’s Unfair Competition...
Imec achieves record 8.4 percent conversion efficiency in fullerene-free organic solar cell
03/12/2014In this week’s Nature Communications, imec presents the development of fullerene-free organic photovoltaic ...
 
GaN-on-Si enables GaN power electronics, will LED transition as well?
03/19/2014Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternati...
SanDisk files lawsuit against SK Hynix for theft of trade secrets
03/13/2014These actions relate to the theft of trade secrets related to NAND flash technology by a former engineer of SanDisk who left the compan...

MAGAZINE




BLOGS


TWITTER


NEWS ANALYSIS & FEATURES


Highlights from the IMAPS Device Packaging Conference

03/24/2014  The annual IMAPS Device Packaging Conference in Ft McDowell AZ is always a source for the latest packaging information.

New technique makes LEDs brighter, more resilient

03/21/2014  Researchers from North Carolina State University have developed a new processing technique that makes light emitting diodes (LEDs) brighter and more resilient by coating the semiconductor material gallium nitride (GaN) with a layer of phosphorus-derived acid.

Discovery of new semiconductor holds promise for 2D physics and electronics

03/21/2014  From super-lubricants, to solar cells, to the fledgling technology of valleytronics, there is much to be excited about with the discovery of a unique new two-dimensional semiconductor, rhenium disulfide, by researchers at Berkeley Lab’s Molecular Foundry.

Mentor Graphics acquires Berkeley Design Automation

03/21/2014  Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. BDA addresses nanometer circuit design challenges via its Analog FastSPICE unified verification platform and exceptional vertical-application expertise.

The Week in Review: March 21, 2014

03/21/2014  UC Berkley research in on-chip inductors; Equipment bookings and billings continue along a steady trend; SMIC CEO awarded SEMI Outstanding EHS Achievement Award; EVG opens HQ in China; ChaoLogix offers security for semi chips; Applied Materials named a World's Most Ethical Company

ChaoLogix introduces ChaoSecure technology to boost semiconductor chip security

03/20/2014  ChaoLogix, Inc., a semiconductor technology provider focused on developing embedded security and low-power design intellectual property, today introduced ChaoSecure technology that deters side channel attacks on semiconductor chips and contributes a superior layer of security compared to existing solutions.

Enabling mobility for IoT with advanced semiconductor technology - at SEMICON Singapore 2014

03/20/2014  SEMICON Singapore will focus on the advanced technology developments to enable mobility for the Internet of Things (IoT).

Equipment bookings and billings continue along a steady trend

03/20/2014  North America-based manufacturers of semiconductor equipment posted $1.29 billion in orders worldwide in February 2014 (three-month average basis) and a book-to-bill ratio of 1.00.

Applied Materials honored as a 2014 World's Most Ethical Company

03/20/2014  Applied Materials, Inc. today announced that it was named a 2014 World's Most Ethical Company by the Ethisphere Institute, an independent center of research promoting best practices in corporate ethics and governance.

MediaTek to deploy Synopsys IC Compiler for hierarchical design implementation

03/19/2014  Synopsys, Inc. today announced that MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions, has initiated deployment of Synopsys' IC Compiler place and route solution for hierarchical design implementation.

SMIC CEO is awarded SEMI Outstanding EHS Achievement Award

03/19/2014  Dr. Tzu-Yin Chiu, Chief Executive Officer & Executive Director of SMIC presented the SEMICON China 2014 opening keynote yesterday and was given a SEMI Outstanding EHS Achievement Award.

M+W Group and Siemens to collaborate on process control technology solution for battery production

03/19/2014  Siemens Industry Automation Division and M+W Group have joined forces with the aim to advance the development of production technology for battery manufacturing and develop a complete control technology solution for the mass production of large-size batteries.

SRC, UC Berkeley research promises to revolutionize electronic circuit design

03/19/2014  Research from University of California, Berkeley scientists sponsored by Semiconductor Research Corporation (SRC) promises to revolutionize portable radio frequency (RF) electronics and communication systems via advancements in on-chip inductors by leveraging embedded nanomagnets.

First methodology to analyze nanometer line pattern images

03/18/2014  To meet the increasing demand for smaller, faster, and more powerful devices, a continued decrease in the dimensions of active parts of devices is required. The new methodology is a unique tool developed to address the gap existent in the metrology of sub-10nm line patterns.

MORE ANALYSIS & FEATURES

VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

Intentional Innovation Drives Market Success

Growth Markets Require Forward-Looking SolutionsNovember 21, 2013
Sponsored by Henkel Corporation

More Technology Papers

WEBCASTS

3D Integration and Advanced Packaging Innovation

March 27 at 2:00 p.m. ET 2.5/3D integration and advanced packaging enable better chip performance in a smaller form factor, meeting the needs of smartphones, tablets, and other advanced devices. However, 2.5/3D packaging creates a new set of manufacturing challenges, such as the need to fabricate copper pillars, TSVs, wafer bumping and redistribution layers – which may involve thicker photoresists, spin-on dielectrics and BCB coatings -- and processing may be done on panels instead of round wafers. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:
Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
Materials for Semiconductor Manufacturing

Dec 18 at 1 p.m. EST. Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:
More Webcasts

EVENTS

The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014

FINANCIALS

NEW COMMENTS


QEOS announces advanced LED lighting system
Moore's Law has stopped at 28nm
GaN-on-Si enables GaN power electronics, will LED transition as well?

NEW PRODUCTS

NanoWorld AG introduces ultra-short cantilevers for high-speed atomic force microscopy
03/11/2014After a very successful beta-testing phase, six types of AFM probes for high speed scanning will be commercially a...
Electrolube launches versatile new silver conductive adhesive for display applications
03/10/2014Electrolube, the leading supplier of formulated chemical products to the global electronic, industrial and domesti...
Extremely accurate conductive measurement technology at nanoscale resolution for failure analysis
03/04/2014Park Systems, a manufacturer of Atomic Force Microscopy systems since 1997 announced PinPoint Conductiv...