Leveraging significant presence in TSV markets, ALLVIA, Inc. has expanded its capacity into glass and quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers. This will enable next-generation semiconductor 2D and 2.5 D packaging solutions using ultra-thin glass and quartz.
ALLVIA will manufacture ultra-thin glass and quartz interposers using its facility fully equipped for high volume manufacturing of TSV interposers to commercialize the widespread use of interposers. The company will expand its intellectual property from silicon to glass in hole drilling and filling methodologies to fabricate its interposers.
ALLVIA will apply its proprietary technology to fill the high-aspect-ratio via holes with copper plating. ALLVIA’s processes and its production line can produce all types of interposers to achieve the next generation in high-density semiconductor packaging. These 2D and 2.5D interposers are needed to form the electrical connections between a silicon chip and PCBs.
Sergey Savastiouk, CEO, commented: “Our expansion allows us to solve two problems. First, ALLVIA becomes more flexible with customer requests and, second, ALLVIA can produce more wafers with better quality using state-of-the-art for copper plating, chemical mechanical polishing, deep via thin film deposition.”