Texas Instruments Incorporated (TI) announced that Devan Iyer has been elected vice president of the company. As vice president of worldwide semiconductor packaging, Iyer leads a global team responsible for determining the semiconductor packaging design and technologies that help customers differentiate their products and enable further cost-effective advancements in miniaturization and performance.
“Devan’s technical expertise and commitment to innovation are vital to TI’s growth as we deliver the next wave of advanced packaging solutions to meet customers’ needs,” said Kevin Ritchie, senior vice president of Technology and Manufacturing Group.
Iyer joined TI in 2008 in TI’s Technology and Manufacturing Group as a manager of semiconductor packaging. He most recently served as director of worldwide semiconductor packaging and has more than 22 years of semiconductor industry and R&D experience.
Iyer earned a bachelor’s degree in applied electronics from the University of Kerala in India, as well as a master’s degree in microelectronics from the Indian Institute of Technology Kharagpur in India and a doctoral degree in microelectronics from the Loughborough University of Technology in the United Kingdom.