Date: Wednesday, April 26, 2017 at 2 p.m. ET
Free to attend
Length: Approximately one hour
Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and characterization. In this webcast, hear from leading metrology expert Alain Diebold, who will discuss new challenges and opportunities in the field of semiconductor metrology, focusing on new transistor structures, nanoscale films and structures and how to use plasmonics with scatterometry to increase sensitivity to metal linewidth.
Alain Diebold, Interim Dean, College of Nanoscale Sciences
Alain Diebold is Interim Dean at the Colleges of Nanoscale Science and Engineering (CNSE) SUNY Polytechnic Institute. He is also the Empire Innovation Professor of Nanoscale Science; Executive Director, Center for Nanoscale Metrology; and Executive Director, NC3. He is a fellow of the American Vacuum Society and SPIE as well as a senior member of the IEEE. He is an associate editor for IEEE’s Transactions on Semiconductor Manufacturing. Before moving to Albany, Alain was a Senior Fellow at SEMATECH. Prior to moving to Austin, He was a senior chemist at Allied Signal in Morristown, NJ. Alain received his PhD from Purdue University in 1979.
Sponsored by National Instruments
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