Date: August 2015 (Date and time TBD)
Free to attend
Length: Approximately one hour
Registration will be available soon. Click here to pre-register.
Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.
Sponsored by Air Products
Air Products has been a leading global supplier of high-purity gases, chemicals, and delivery systems to the electronics industry for over 40 years. We serve all major segments of the industry with a unique combination of offerings, experience, and commitment. We’re advancing materials science. We’re advancing semiconductors. We’re advancing mobility. What can we help you advance? www.airproducts.com/advancing
