3D Integration
Date: April 2015 (Date and time TBD)
Free to attend
Length: Approximately one hour
Registration will be available soon. Click here to pre-register.
Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.
Sponsored by Nordson DAGE
Nordson DAGE is part of the Advanced Technology - Electronics Systems Group of Nordson Corporation (NASDAQ: NDSN) and manufactures and supports a complete range of Industry leading Test and Inspection equipment for the PCBA and Semiconductor industries. The Nordson DAGE XM8000 Wafer Metrology Platform provides an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps and provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions. www.measuringtheinvisible.com
