MEMS

MEMS ARTICLES



Imec and Holst Centre demonstrate low-power ECG-acquisition chip at ISSCC 2014

02/12/2014  At this week’s International Solid State Circuits Conference (ISSCC2014), imec and Holst Centre, together with Olympus, demonstrated a low-power single channel implantable electrocardiography (ECG) acquisition chip with analog feature extraction, which enables precise monitoring of the signal activity in a selected frequency band.

Fujitsu Labs and imec develop wireless transceiver technology for medical devices

02/12/2014  Fujitsu Laboratories Ltd. and imec Holst Centre today announced that they have developed a wireless transceiver circuit for use in body area networks (BAN) for medical applications that adheres to the 400 MHz-band international standard.

Intermolecular and Guardian Industries expand collaboration

02/11/2014  Intermolecular, Inc. and Guardian Industries announced today the expansion and extension of their collaborative development program and strategic IP licensing agreement.

Chips that listen to bacteria

02/11/2014  A research team led by Ken Shepard, professor of electrical engineering and biomedical engineering at Columbia Engineering, and Lars Dietrich, assistant professor of biological sciences at Columbia University, has demonstrated that integrated circuit technology, the basis of modern computers and communications devices, can be used for a most unusual application—the study of signaling in bacterial colonies.

CEA-Leti announces the launch of PIEZOMAT

02/11/2014  CEA-Leti today announced the launch of PIEZOMAT, a research project funded by the European Commission to design and implement a new technology of fingerprint sensor that enables ultra-high resolution reconstruction of the smallest features of human fingerprints.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

02/06/2014  The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

Intel elects five new corporate vice presidents

02/06/2014  Intel Corporation today announced that its board of directors elected five new corporate vice presidents.

Ballistic transport in graphene suggests new type of electronic device

02/06/2014  Using electrons more like photons could provide the foundation for a new type of electronic device that would capitalize on the ability of graphene to carry electrons with almost no resistance even at room temperature – a property known as ballistic transport.

Capturing ultrasharp images of multiple cell components at once

02/04/2014  A new microscopy method could enable scientists to generate snapshots of dozens of different biomolecules at once in a single human cell, a team from the Wyss Institute of Biologically Inspired Engineering at Harvard University reported Sunday in Nature Methods.

Entegris to acquire ATMI

02/04/2014  Entegris, Inc. and ATMI today announced Entegris will acquire ATMI for approximately $1.15 billion, or approximately $850 million net of cash acquired, including the net cash proceeds from the sale of ATMI’s LifeSciences business of $170 million.

"MEMS and NEMS processing advances" discussed at IEMN, Lille, France workshop on 8th April 2014

02/03/2014  "Nanoscale Processing for NEMS and MEMS" is the topic for the next Oxford Instruments technical workshop, being hosted in conjunction with the Institute of Electronics Micro-electronics and Nanotechnology (IEMN) in Lille, France on 8th April 2014.

Element Six's synthetic diamond proven as viable material for sophisticated optical components

02/03/2014  Element Six, a developer of synthetic diamond supermaterials and member of the De Beers Group of Companies, today presented new data and announced that its high purity single crystal chemical vapor deposition (CVD) diamond material has been proven for use in intracavity cooling of disc lasers and in development of the first ever tunable diamond Raman laser system.

2014 capital spending up in Korea; SEMICON Korea to address mobile innovation

01/31/2014  With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing.

Presto and DelfMEMS collaborate to design ultra fast RF MEMS test solution

01/30/2014  Presto Engineering, Inc. and DelfMEMS announced today that they have worked together to design, from specification to integration, the first full PXI-based test system for ultra-fast characterization testing of radio frequency (RF) micro-electro-mechanical-systems (MEMS).

New "photodetector" nanotechnology allows photos in near darkness

01/29/2014  Dark and blurry low light photos could soon be a thing of the past, thanks to the development of game-changing ultrathin “nanosheets,” which could dramatically improve imaging technology used in everything from cell phone cameras, video cameras, solar cells, and even medical imaging equipment such as MRI machines.

MEMS Industry Group explores the “MEMS-enabled Life” at MEMS Executive Congress Europe 2014

01/28/2014  MEMS Industry Group (MIG) will host its third annual MEMS Executive Congress® Europe, 11 March, 2014 in Munich, Germany.

Slimpin promoted to director in SwRI’s Applied Physics Division

01/28/2014  David G. Slimpin has been promoted to director of the Electronics Systems and Robotics Department in the Applied Physics Division at Southwest Research Institute (SwRI). He was previously a program manager in the department.

Book-to-bill ratio continues to improve

01/24/2014  The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.

2014 Outlook: An era of unprecedented change

01/24/2014  We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

Semiconductors that detect cancer

01/23/2014  As exciting as it is to watch the semiconductor industry push to sub-10nm dimensions, 450mm wafers, finFETs, 3D ICs and the like, what’s even cooler is the potential of semiconductor technology to make a real difference in medicine.




FINANCIALS



TECHNOLOGY PAPERS



Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

Intentional Innovation Drives Market Success

Growth Markets Require Forward-Looking SolutionsNovember 21, 2013
Sponsored by Henkel Corporation

More Technology Papers

WEBCASTS



Materials for Semiconductor Manufacturing

Dec 18 at 1 p.m. EST. Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:
Next Generation Metrology and Inspection

Nov 21 at 2 PM ET. Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:
Advanced Packaging

Packaging technology is driven by a combination of cost, performance, form factor and reliability. This webcast will examine new advances in conventional back-end packaging, including wafer bumping and copper wire bonding, as well as the role of new 2.5D and 3D integration. Presenters will focus on isssues related to cost, performance (speed, power and noise immunity), form factor (thickness, weight, PCB area consumption), and testability, as well as the tradeoff of technical maturity versus risk in high-volume manufacturing.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON China 2014
Shanghai, China
http://www.semiconchina.org
March 18, 2014 - March 20, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014