MEMS industry influencers to present at SEMI European MEMS Summit

SEMI has announced that executives from MEMS giants Bosch and STMicroelectronics, MEMS largest fabless Invensense and dominating IC foundry TSMC will be delivering the keynote talks at the European MEMS Summit (Sept 17-18, 2015 – Milan, Italy).

For the first installment of SEMI’s European MEMS Summit, themed “Sensing the Planet, MEMS for Life,” Stefan Finkbeiner, GM and CEO of Bosch Sensortec, Benedetto Vigna, Executive VP and General Manager of the Analog, MEMS & Sensors group of STMicroelectronics, Behrooz Abdi, CEO and President of Invensense, and Maria Marced, President of TSMC Europe will join SEMI to share their vision of the current challenges facing the MEMS industry and their recipes for success. With these headliners, SEMI’s European MEMS Summit promises to be a powerhouse of MEMS experts, both from a technological standpoint and from a business standpoint.

“We are very excited to offer attendees a high-profile collection of international speakers for this first edition of our European MEMS Summit,” commented Yann Guillou, business development manager at SEMI. “Elaborated with the support of industry representatives, we have made an effort to address the most crucial industry issues with the belief that this conference program will be a positive contribution to the MEMS industry and will help MEMS actors collectively shape their industry’s progress. Above all, our hope is that attendees will leave the Summit with a better understanding of the crucial technological and business challenges faced by the MEMS value chain as well as an idea of the solutions that are being proposed today to address those problems.”

The Summit’s conference will bring together a diversity of high caliber MEMS technology experts, including representatives of ARM, ASE Group, CEA-Leti, Freescale, IHS, Infineon, SITRI, Tronics Microsystems, X-FAB, Yole Développement and more. The event will insist on the importance of understanding the dynamics of the marketplace in perpetuating a global comprehension of the evolution of MEMS. Speakers will provide their outlooks on the MEMS market, their expectations for future marketplace trends and their assessment of the changes in business models, the supply chain, and the ecosystem. One full day of the event will be dedicated to “Applications” to give attendees a more global vision of how MEMS are being applied in the automotive, consumer electronics, wearable and industrial sector as well as the importance of MEMS in the growth of the Internet of Things. Despite a strong focus on business-related aspects, technology will not be forgotten; speakers will address topics such as new detection principles, innovation in materials, new packaging solutions, MEMS on 300mm wafers and more.

The Summit will be held at the grandiose Palazzo Lombardia, in Milan, Italy. At the heart of the Palazzo and in complement to the conference, SEMI will organize a MEMS Exhibition, giving companies with MEMS activities a chance to reach out to other participants who are coming from the same sector. The European MEMS Summit will include numerous networking opportunities – a gala dinner, a networking cocktail hour and numerous coffee and lunch breaks.

For any question regarding the event, contact Yann Guillou from SEMI ([email protected]).


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>



New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...