Compiled by Shannon Davis, Web Editor
This week in Las Vegas, the 2014 International Consumer Electronics Show focused on the Internet of Things, displaying many connected gadgets and services. This year’s show featured more than 3,200 exhibitors, many of which were excited to show off new Internet-enable devices.
Click through our slideshow of highlights for an overview of the show.
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SAMCO unveils deep silicon etching system for MEMS and TSV production processing
High-performance Opterra multipoint scanning confocal microscope
Brewer Science commercializes thermal slide debonder
Enhancing the Performance of Electronic Applications with Versatile Epoxy CompoundsLearn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,
Intentional Innovation Drives Market SuccessGrowth Markets Require Forward-Looking SolutionsNovember 21, 2013
Sponsored by Henkel Corporation
Materials for Semiconductor ManufacturingDec 18 at 1 p.m. EST. Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.
Next Generation Metrology and InspectionNov 21 at 2 PM ET. Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.
The magic behind the gadget and the need for innovation
IFTLE 175 2013 IWLPC; 450mm on Hold? 
IEDM 2013 Preview
MEMS: An Enabler of the Next Internet Revolution
Source Workshop Presents Data on Readiness of 50 W EUV Sources to Support EUVL Scanners| Required fields in bold |
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