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Selective Articles
Solderability Testing Aids Selective Soldering Process Development (Aug 25, 2009)

Greg Goodell, process development technician, A.C.E. Production Technologies, recounts tests done in the company's Selective Soldering Applications Lab. A component had oxidized leads. During process development, the operator found that no matter which flux was selected, or which profile was used, the solder would not wet to the part. Process development for the application was stalled by the solder dewetting. Solderability tests were performed to analyze the wetting curve and determine the cause of wetting failure.

Selective Soldering Fills a Gap in Design for Manufacturing (Jul 11, 2009)
By Todd King, E.I. Microcircuits
Design for manufacturability (DfM) is extremely important to today's electronics production. DfM can help EMS providers deliver the best product possible at the lowest production cost. One way to avoid costly hand soldering on intricate mixed-assembly boards is selective soldering.
Surface Mount Technology Industry News
Flextronics to Build Suzhou, China Facility to Support Computing Manufacturing, R&D; (Oct 16, 2009)

In a signing ceremony held today with Suzhou Wuzhong Economic Development Zone and Jiangsu Wuzhong Export Processing Zone, electronics manufacturing services (EMS) provider Flextronics (Nasdaq: FLEX) announced it will expand its presence in China through the development of a new facility in Wuzhong. The facility will support the growing demand for computing products in China and will include a design center and extended manufacturing capabilities in the Wuzhong Export Processing Zone (WEPZ). The design center will be completed by the end of 2009 and the manufacturing facility is expected to be completed by the end of 2010.

Kyzen Equips Application Laboratory in Penang, Malaysia (Oct 14, 2009)

Cleaning products provider Kyzen plans to add an applications laboratory in its new Penang, Malaysia sales and support office.

ECT, ScanCAD Partner on Process Management Work Instruction Software (Oct 14, 2009)

Everett Charles Technologies (ECT), a Dover Company, finalized a strategic partnership with ScanCAD International, a global supplier of process management tools. This partnership provides for ScanCAD International to exclusively distribute and support the ProWorks process management work instruction software family of products globally within the electronics industry.

Mentor Graphics, Valor Agree to Merge (Oct 13, 2009)

Mentor Graphics Corporation (NASDAQ: MENT) and Valor Computerized Systems Ltd. (Prime Standard: VCR) have signed a definitive merger agreement for Mentor Graphics to acquire Valor.

Participate at APEX 2010 (Oct 12, 2009)

IPC is currently accepting abstracts from students, researchers, industry experts, and engineers in all areas of electronics and solar cell assembly for the 2010 IPC APEX Expo, April 6–8, 2010, at the Mandalay Bay Resort & Convention Center, Las Vegas. Abstracts are due in January 2010.

Soldering Videos
The A-Line at IPC Midwest produces a PCB assembly with jet solder printing, dual-head pick-and-place, reflow, and depanelization.; Assembly; cab; ipc; IPC Midwest; Juki; Mydata; Senju; smt; The Morey Corp; Al Cabral, marketing manager, VJ Electronix, demonstrates solder rework and X-ray inspection with the company's new machines.; 2D X-ray; manual inspection; rework; VJ Electronix; X-ray inspection; Ed Zamborsky, regional sales manager, OK International, shows solder paste/flux/adhesive dispensers, soldering stations, and the basics of hand soldering.; adhesives; dispensing; flux; hand soldering; OK International; Oki; solder paste; Keith Howell and Masato Nakamura of Nihon Superior discuss the halogen-free solder products debuting at SMTAI. Nihon?s SN100C lead-free solder is the base of this product line.; alloys; dopants; intermetallic layer; lead-free; Nihon Superior; sac; solder; solder paste; Gene Dunn, Panasonic Factory Solutions of America, examines thin-die packaging issues that EMS providers will need to consider in board layout for bend possibilities, pick-and-place systems for picking force, and reflow for overheat concerns. ; board design; Fragile Components; Fragile Packages; Miniaturization; panasonic; pick-and-place; reflow; smt; Thin Die; Rick Short, director of marketing and communications at Indium Corporation, talks about lead-free rework and solar cell manufacturing's materials requirements.; indium; lead-free; photovoltaics; rework; SMTAI; solar cells; solder; Steve Pollock, sales manager at Essemtec, demostrates the printer, pick-and-place, and lead-free convection reflow oven that comprise their turnkey line.; complete line; Essemtec; lead-free reflow; manufacturing line; pick and place; printer; reflow; SMTAI; turnkey manufacturing; Rob DiMatteo introduces BTU's smaller lead-free-capable reflow system, as well as a high-volume 12-zone model, and new lane options for existing systems.; BTU; conveyors; ems; high-volume; lead-free; medical; Military; reflow; SMTAI; Paul Salmon, Balver Zinn, explains the global alliance for the SN100C lead- and silver-free solder alloy, shared with Nihon Superior and other partners. ; Balver Zinn; lead-free solder; Nihon Superior; sac; SMTAI; SN100C; tin-free solder; Brian Toleno, Ph.D., Henkel, describes the FF6000 material -- an epoxy flux and adhesive for innovative electronics assembly.; apex; conductive adhesive; epoxy; flux; Henkel; soldering materials; Tom Nash of BTU discusses reflow trends in nitrogen, process control, and COO.; Josef Jost, Balzer Zinn, parent company of Cobar, explains the XF3 flux medium for SAC, SN100C, and tin/lead alloys.; apex; Balver Zinn; Cobar; flux; lead-free; sac; SN100C; solder; tin/lead; Chris Underhill of Finetech provides rework advice for challenging package and PCBA applications.; 01005; apex; BGA; Finetech; packaging; repair; rework; stacked die; Erik Bergum, Heraeus, tells us about their ball-dippable paste, developed with TI to replace tacky fluxes in solder sphere placement.; apex; ball-dippable paste; flux; Heraeus; solder powder; solder spheres; Mark Dalderup, Rehm, discusses his company's international goals and their vapor-phase reflow products, including a vacuum system to prevent voids.; apex; reflow; Rehm Thermal; solder joints; vapor-phase; voids; Vincent Whipple, Sono-Tek, demonstrates the ultrasonic atomiztion technology behind spray fluxing.; apex; Fluxing; Sono-Tek; Spray Flux; Ultrasonic Atomization; Bennet Bruntil tours EVS's solder recovery technology under the hood of the system.; Solder and equipment suppliers provide live demos of dross recovery, wave and reflow soldering, selective soldering systems, rework & repair capabilites, and next-generatiosn leaded and lead-free solder and flux materials.
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