Robert Avila and Wade Gay, Finetech, describe the steps to BGA rework, aided by video clips of rework in action. There are at least five steps in successfully completing the cycle for BGA rework. These steps, which include component removal, site cleaning, reballing, and soldering, do not change, independent of whether or not the BGA is on a PCB that is large, small, thin, or thick, etc.
Research and Markets Ltd. released its latest research on the world surface mount technology (SMT) solder paste, solder preform, and surface mount adhesives markets. “World Solder Paste, Solder Preform and Surface Mount Adhesives Market” provides an overview of these markets along with analysis of key drivers, restraints, and challenges. Revenue forecasts by geographic region, pricing, and distribution trends are examined. This research also covers the competitive framework and market share analysis of the industry participants.
Following are the new solders, fluxes, reflow ovens and profilers, wave soldering systems, conveyors, rework tools, and more for reliable, repeatable soldering by hand, selective soldering system, wave, or reflow oven.
Paul Austen, ECD, explains why information gathering and reflow profile characterization can be wasted practices without the verification step to maintain proper oven operation. Reflow oven profiles can be out of spec due to flux residue build up, belt speed changes, and other small changes that deliver significant alterations to the assembly being processed.
Showcasing the latest expansion of its global stencil network, DEK and new franchisee AGI Corporation opened the doors of their manufacturing operation to local customers in the Americas. Attended by both leading EMS and OEM electronics firms and Huntsville Mayor Tommy Battle, the DEK-AGI Open House was designed to highlight the company’s stencil production expertise.
Personal computer maker Lenovo Group said Friday it is joining the race to develop products that link phones and PCs by buying back a mobile phone business that it sold last year, reports the Associated Press (AP).
Michael J. Palma, senior research analyst in the semiconductors team at IDC, published the “EMS Industry Forecast 2009–2013: Hints of Recovery” report. This IDC update provides IDC's electronic manufacturing services (EMS) industry forecast from 2008 through 2013. It includes forecasts for the EMS and original design manufacturing (ODM) sectors, product segments, and regions. This update also reviews the state of the industry and core forecast scenario and assumptions.
Though the recession has virtually decimated the computer industry, Henderson Ventures analysts predict double-digit computer industry gains by 2011. This year, the traditional Q’04 holiday bump in sales is expected to reappear, after being waylaid last year by the onset of the financial crisis.
PCB design, engineering, and manufacturing provider Electronic Interconnect (EI) will engage in a cooperative agreement with Flex Interconnect Technologies (FIT — Milpitas, CA) to jointly provide a wider range of PCB products. EI specializes primarily in rigid PCB types, while FIT provides design and manufacturing to final assembly of flexible circuits, rigid-flex, and HDI flex.
Sustainability Commitment A Key Driver for Product Development
There's a lot of talk about sustainability these days. While some firms have truly embraced a plan to drive toward more environmentally responsible products and ...
Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ...
Sponsored By: Austin American Technology Corp.
Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
by Brian Toleno, Ph.D., Henkel CorporationIf you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed ...
SMT Magazine's editorial team discusses industry events, trends and important news for electronics manufacturers, IDMs, OEMs and related companies.