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Soldering Articles
STEP 10 Rework and Repair: The Complete BGA Rework Process (Nov 17, 2009)

Robert Avila and Wade Gay, Finetech, describe the steps to BGA rework, aided by video clips of rework in action. There are at least five steps in successfully completing the cycle for BGA rework. These steps, which include component removal, site cleaning, reballing, and soldering, do not change, independent of whether or not the BGA is on a PCB that is large, small, thin, or thick, etc.

World Solder Paste, Solder Preform and Surface Mount Adhesives Market (Nov 14, 2009)

Research and Markets Ltd. released its latest research on the world surface mount technology (SMT) solder paste, solder preform, and surface mount adhesives markets. “World Solder Paste, Solder Preform and Surface Mount Adhesives Market” provides an overview of these markets along with analysis of key drivers, restraints, and challenges. Revenue forecasts by geographic region, pricing, and distribution trends are examined. This research also covers the competitive framework and market share analysis of the industry participants.

New Solders and Soldering Products (Oct 20, 2009)

Following are the new solders, fluxes, reflow ovens and profilers, wave soldering systems, conveyors, rework tools, and more for reliable, repeatable soldering by hand, selective soldering system, wave, or reflow oven.

A Shift in the Perception of Reflow Profiling (Oct 13, 2009)

Paul Austen, ECD, explains why information gathering and reflow profile characterization can be wasted practices without the verification step to maintain proper oven operation. Reflow oven profiles can be out of spec due to flux residue build up, belt speed changes, and other small changes that deliver significant alterations to the assembly being processed.

Surface Mount Technology Industry News
DEK and Stencil Franchisee AGI Demonstrate Advanced Printing Technology (Dec 1, 2009)

 Showcasing the latest expansion of its global stencil network, DEK and new franchisee AGI Corporation opened the doors of their manufacturing operation to local customers in the Americas. Attended by both leading EMS and OEM electronics firms and Huntsville Mayor Tommy Battle, the DEK-AGI Open House was designed to highlight the company’s stencil production expertise. 

Lenovo Reaquiring Mobile Phone Unit (Nov 30, 2009)

Personal computer maker Lenovo Group said Friday it is joining the race to develop products that link phones and PCs by buying back a mobile phone business that it sold last year, reports the Associated Press (AP).

IDC Releases EMS Industry Forecast 2009-2013 (Nov 30, 2009)

Michael J. Palma, senior research analyst in the semiconductors team at IDC, published the “EMS Industry Forecast 2009–2013: Hints of Recovery” report. This IDC update provides IDC's electronic manufacturing services (EMS) industry forecast from 2008 through 2013. It includes forecasts for the EMS and original design manufacturing (ODM) sectors, product segments, and regions. This update also reviews the state of the industry and core forecast scenario and assumptions.

Henderson Forecast: Computer Equipment (Nov 30, 2009)

Though the recession has virtually decimated the computer industry, Henderson Ventures analysts predict double-digit computer industry gains by 2011. This year, the traditional Q’04 holiday bump in sales is expected to reappear, after being waylaid last year by the onset of the financial crisis.

PCB Fab Partnership: Electronic Interconnect Collaborates with Flex Interconnect Technologies (Nov 25, 2009)

PCB design, engineering, and manufacturing provider Electronic Interconnect (EI) will engage in a cooperative agreement with Flex Interconnect Technologies (FIT — Milpitas, CA) to jointly provide a wider range of PCB products. EI specializes primarily in rigid PCB types, while FIT provides design and manufacturing to final assembly of flexible circuits, rigid-flex, and HDI flex.

Current Issue
SMT
Volume 23, Issue 6
November 2009
Soldering Videos
The A-Line at IPC Midwest produces a PCB assembly with jet solder printing, dual-head pick-and-place, reflow, and depanelization.; Assembly; cab; ipc; IPC Midwest; Juki; Mydata; Senju; smt; The Morey Corp; Al Cabral, marketing manager, VJ Electronix, demonstrates solder rework and X-ray inspection with the company's new machines.; 2D X-ray; manual inspection; rework; VJ Electronix; X-ray inspection; Ed Zamborsky, regional sales manager, OK International, shows solder paste/flux/adhesive dispensers, soldering stations, and the basics of hand soldering.; adhesives; dispensing; flux; hand soldering; OK International; Oki; solder paste; Keith Howell and Masato Nakamura of Nihon Superior discuss the halogen-free solder products debuting at SMTAI. Nihon?s SN100C lead-free solder is the base of this product line.; alloys; dopants; intermetallic layer; lead-free; Nihon Superior; sac; solder; solder paste; Gene Dunn, Panasonic Factory Solutions of America, examines thin-die packaging issues that EMS providers will need to consider in board layout for bend possibilities, pick-and-place systems for picking force, and reflow for overheat concerns. ; board design; Fragile Components; Fragile Packages; Miniaturization; panasonic; pick-and-place; reflow; smt; Thin Die; Rick Short, director of marketing and communications at Indium Corporation, talks about lead-free rework and solar cell manufacturing's materials requirements.; indium; lead-free; photovoltaics; rework; SMTAI; solar cells; solder; Steve Pollock, sales manager at Essemtec, demostrates the printer, pick-and-place, and lead-free convection reflow oven that comprise their turnkey line.; complete line; Essemtec; lead-free reflow; manufacturing line; pick and place; printer; reflow; SMTAI; turnkey manufacturing; Rob DiMatteo introduces BTU's smaller lead-free-capable reflow system, as well as a high-volume 12-zone model, and new lane options for existing systems.; BTU; conveyors; ems; high-volume; lead-free; medical; Military; reflow; SMTAI; Paul Salmon, Balver Zinn, explains the global alliance for the SN100C lead- and silver-free solder alloy, shared with Nihon Superior and other partners. ; Balver Zinn; lead-free solder; Nihon Superior; sac; SMTAI; SN100C; tin-free solder; Brian Toleno, Ph.D., Henkel, describes the FF6000 material -- an epoxy flux and adhesive for innovative electronics assembly.; apex; conductive adhesive; epoxy; flux; Henkel; soldering materials; Tom Nash of BTU discusses reflow trends in nitrogen, process control, and COO.; Josef Jost, Balzer Zinn, parent company of Cobar, explains the XF3 flux medium for SAC, SN100C, and tin/lead alloys.; apex; Balver Zinn; Cobar; flux; lead-free; sac; SN100C; solder; tin/lead; Chris Underhill of Finetech provides rework advice for challenging package and PCBA applications.; 01005; apex; BGA; Finetech; packaging; repair; rework; stacked die; Erik Bergum, Heraeus, tells us about their ball-dippable paste, developed with TI to replace tacky fluxes in solder sphere placement.; apex; ball-dippable paste; flux; Heraeus; solder powder; solder spheres; Mark Dalderup, Rehm, discusses his company's international goals and their vapor-phase reflow products, including a vacuum system to prevent voids.; apex; reflow; Rehm Thermal; solder joints; vapor-phase; voids; Vincent Whipple, Sono-Tek, demonstrates the ultrasonic atomiztion technology behind spray fluxing.; apex; Fluxing; Sono-Tek; Spray Flux; Ultrasonic Atomization; Bennet Bruntil tours EVS's solder recovery technology under the hood of the system.; Solder and equipment suppliers provide live demos of dross recovery, wave and reflow soldering, selective soldering systems, rework & repair capabilites, and next-generatiosn leaded and lead-free solder and flux materials.
Surface Mount Technology White Papers

Featured White Papers

Sustainability Commitment A Key Driver for Product Development
There's a lot of talk about sustainability these days. While some firms have truly embraced a plan to drive toward more environmentally responsible products and ...
Sponsored By:  Henkel Corporation
Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ...
Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
by Brian Toleno, Ph.D., Henkel CorporationIf you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed ...
Sponsored By:  Henkel Corporation

Recent White Papers

Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ...
Sponsored By:  Henkel Corporation
SMT Blog
by SMT Magazine

SMT Magazine's editorial team discusses industry events, trends and important news for electronics manufacturers, IDMs, OEMs and related companies.

Eastern European Near-sourcing on the Rise

Much has been made of the attendance numbers at productronica 2009 this year in Munich, Germany. As economic reports have trumpeted a better 2010, and electronics manufacturers have started to see a ramp in RFQs and orders, productronica’s attendance...

IPC Midwest: Friends, Fellowship, and Live SMT Assembly

It was a better-than-expected IPC Midwest tradeshow and conference in Schaumburg, IL this September. The A-Line live electronics assembly line attracted interest as each piece of automated equipment performed its task to build a mixed-assembly board with...

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