ITM Marketing released a report providing a comprehensive analysis of the automated optical inspection (AOI) system offerings for the electronics assembly industry.
Several inspection companies debuted new models at productronica 2009 in Munich, Germany, with traditionally solder paste inspection (SPI) companies entering the automated optical inspection (AOI) market, and vice versa. While inspection companies have steadily pushed for optical inspection earlier in the SMT assembly line (pre-reflow), this move was markedly widespread, with Koh Young, Mirtec, Marantz, Viscom, and others looking to capture market share outside of their core inspection sector.
JTAG Technologies released JTAG Live; Surface Mount Technology Corp debuted the SMART platform; Pickering Interfaces introduced RF Matrix LXI switches; Vi TECHNOLOGY upgraded its inspection offerings; Marantz entered solder paste inspection (SPI); and ASSET debuted IC test.
Test program set (TPS) migration solutions address the problem of legacy automated test equipment (ATE) systems that support validation of military/aerospace systems experiencing end of life (EOL) issues. Robert Peet, SEICA, will review a cross section of ATE systems from both a hardware and software perspective, with specific emphasis on the challenges and solutions for test program sets using LASAR™ simulation. Migrating existing TPS from legacy systems* to current technology can be done at considerably reduced time and cost with modern TPS software migration tools. These allow for easy conversion and migration of functional test (FT) programs, with minimal debug. By retaining features such as guided probe, fault dictionary, and many others, test programs developed as far back as the 1970s are easily ported to state-of-the-art testers without losing functionality. Legacy programs can also be enhanced (post-migration) with new software tools. Modern migration tools, combined with hardware advances, can improve test coverage and diagnostic capabilities.
In Part I of this article, we asked test and inspection equipment providers for their perspectives on equipment evolution and contemporary challenges. In Part II, we ask what test and inspection customers want from their equipment, and look at examples of difficult test/inspection problems and how to solve them.
Stencil product manufacturer FINE LINE STENCIL, a division of FCT Assembly, will install an LPKF ScanCheck system in its San Jose, CA stencil facility. The LPKF ScanCheck system can be used to examine stencils and masks made with any technology including laser cut, chemical etch, or electro-forming. The system checks for three parameters and detects apertures that are missing, placed incorrectly, or are the incorrect size, based on the Gerber artwork files. Accurate stencil apertures can prevent printing defects in SMT assembly.
Global technical professional association IEEE announced that IEEE Life Fellow Andrew J. Viterbi, co-founder of Qualcomm Incorporated and developer of wireless technologies that became the international standard for third-generation cellular phones, has been named the 2010 IEEE Medal of Honor recipient. The Medal of Honor, IEEE’s highest award, will be presented June 26, 2010, in Montreal, Quebec, Canada as part of IEEE’s annual Honors Ceremony.
Juki Corporation completed construction of its new headquarters and R&D facilities in Tama-shi, Tokyo. The expanded facilities combine the company’s headquarters and R&D functions to speed process development and enhance operational efficiency.
Global shipments of cellphones (excluding white-brand models) are forecasted to grow 12% to 1.33 billion units in 2010, including 235 million smartphones, after holding steady in 2009, reports Quincy Liang of China Economic News Service (CENS). The prediction was made by the Topology Research Institute (TRi), a private market-research firm in Taiwan.
IPC APEX EXPO (April 6–9 in Las Vegas) and SMTA International (October 24–28 in Orlando, FL) are accepting abstracts for the technical conference programs.
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SMT Magazine's editorial team discusses industry events, trends and important news for electronics manufacturers, IDMs, OEMs and related companies.