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Cleaning Materials Articles
The Future of Cleaning OA Fluxes (Sep 11, 2009)

Many companies are shifting away from cleaning with pure de-ionized (DI) water to chemistry-assisted processes. Numerous reasons can be cited supporting the recent trend toward cleaning with chemistry. Results from this experiment, presented by Harald Wack, Ph.D., Zestron, support the hypothesis that cleaning temperature and cleaning chemistry concentration can be manipulated to meet cost and cleanliness requirements for the majority of solder pastes.

Surface Mount Technology Industry News
DEK and Stencil Franchisee AGI Demonstrate Advanced Printing Technology (Dec 1, 2009)

 Showcasing the latest expansion of its global stencil network, DEK and new franchisee AGI Corporation opened the doors of their manufacturing operation to local customers in the Americas. Attended by both leading EMS and OEM electronics firms and Huntsville Mayor Tommy Battle, the DEK-AGI Open House was designed to highlight the company’s stencil production expertise. 

Lenovo Reaquiring Mobile Phone Unit (Nov 30, 2009)

Personal computer maker Lenovo Group said Friday it is joining the race to develop products that link phones and PCs by buying back a mobile phone business that it sold last year, reports the Associated Press (AP).

IDC Releases EMS Industry Forecast 2009-2013 (Nov 30, 2009)

Michael J. Palma, senior research analyst in the semiconductors team at IDC, published the “EMS Industry Forecast 2009–2013: Hints of Recovery” report. This IDC update provides IDC's electronic manufacturing services (EMS) industry forecast from 2008 through 2013. It includes forecasts for the EMS and original design manufacturing (ODM) sectors, product segments, and regions. This update also reviews the state of the industry and core forecast scenario and assumptions.

Henderson Forecast: Computer Equipment (Nov 30, 2009)

Though the recession has virtually decimated the computer industry, Henderson Ventures analysts predict double-digit computer industry gains by 2011. This year, the traditional Q’04 holiday bump in sales is expected to reappear, after being waylaid last year by the onset of the financial crisis.

PCB Fab Partnership: Electronic Interconnect Collaborates with Flex Interconnect Technologies (Nov 25, 2009)

PCB design, engineering, and manufacturing provider Electronic Interconnect (EI) will engage in a cooperative agreement with Flex Interconnect Technologies (FIT — Milpitas, CA) to jointly provide a wider range of PCB products. EI specializes primarily in rigid PCB types, while FIT provides design and manufacturing to final assembly of flexible circuits, rigid-flex, and HDI flex.

Cleaning Videos
Kyzen's VP Tom Forsythe talks about SMTA membership and new cleaning materials hitting the market.; charles hutchins; chemistries; cleaning; cleaning materials; Kyzen; lead-free; SMTA; SMTAI; solder alloys; Craig Hood, Petroferm, introduces a new spray-in-air aqueous cleaner at SMTAI. ; aqueous cleaner; batch cleaning; cleaning electronics; in-line cleaning; Petroferm; SMTAI; Michael Konrad, SMT advisor, shows us Aqueous?s Trident cleaning equipment. The system prewashes, washes, dries, and cleanliness tests at each rinse cycle. ; aqueous; cleaning; cleanliness test; defluxing; PCB cleanliness; SMTAI; trident; Patrice Rollet, Avantec, discusses soldering materials, coatings, and cleaners developed by the Europe-based company. ; apex; aqueous clean; avantec; chemistry clean; cleaning; coating; soldering materials; We discuss the vital role cleaning materials, contamination testing, and cleaning systems affect the SMT manufacturing environment.
Surface Mount Technology White Papers

Featured White Papers

Sustainability Commitment A Key Driver for Product Development
There's a lot of talk about sustainability these days. While some firms have truly embraced a plan to drive toward more environmentally responsible products and ...
Sponsored By:  Henkel Corporation
Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ...
Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
by Brian Toleno, Ph.D., Henkel CorporationIf you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed ...
Sponsored By:  Henkel Corporation

Recent White Papers

Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ...
Sponsored By:  Henkel Corporation
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