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Solder Paste Print Articles
Optimizing a Standard Print Process Eases Mixed Technology Assembly (Dec 1, 2009)

Consumers continue to expect increased functionality in ever smaller electronic products. However, this demand stretches the rules of design-for-manufacture (DfM) and leaves circuit assemblers to wrestle with the combination of decreasing feature sizes coexisting with larger components. Clive Ashmore, DEK, explains how print process control can increase productivity when large and small components coexist on a PCB.

New Stencil Products (Oct 6, 2009)

New stencil products for solder paste printing are designed for cleaner paste release, tighter aperture control, and other user benefits. Stencils, paste print monitors, and process control software debut from DEK, Transition Automation, Photo Stencil, Ascentech, Thin Metal Parts, and Cookson Electronics Engineered Products.

Essemtec to Use Production Solutions RED-E-SET Products (Oct 5, 2009)

Production Solutions Inc., an engineering, design and manufacturing company, entered into an agreement with SMT production equipment maker Essemtec, in which Essemtec will use RED-E-SET products and technologies on its screen printers.

Duplicate Exact from the Stencil Perspective (Sep 16, 2009)

Duplicate exact can help address issues encountered when transferring an assembly from prototype to high-volume manufacturing or from one manufacturing facility to another. Duplicate exact can apply to equipment, materials, tools, and processes in SMT assembly. William E. Coleman, Ph.D, Photo Stencil, examines the stencil tool, though it is easy to see how the concept also transfers throughout the manufacturing operation.

iNEMI Roadmap Identifies R&D; Priorities for Printing (Aug 10, 2009)
By Dongkai Shangguan and Ravi Bhatkal
Component technology advances continue to challenge the PCB assembly environment. The iNEMI Roadmap identifies R&D; priorities for the application and deposition of interconnect materials, as part of the SMT process. The first is to improve stencil printing technology to increase transfer efficiency with thicker stencils and smaller apertures. The second is to optimize jettable pastes and inks as well as jetting/dispensing technology.
Surface Mount Technology Industry News
DEK and Stencil Franchisee AGI Demonstrate Advanced Printing Technology (Dec 1, 2009)

 Showcasing the latest expansion of its global stencil network, DEK and new franchisee AGI Corporation opened the doors of their manufacturing operation to local customers in the Americas. Attended by both leading EMS and OEM electronics firms and Huntsville Mayor Tommy Battle, the DEK-AGI Open House was designed to highlight the company’s stencil production expertise. 

Lenovo Reaquiring Mobile Phone Unit (Nov 30, 2009)

Personal computer maker Lenovo Group said Friday it is joining the race to develop products that link phones and PCs by buying back a mobile phone business that it sold last year, reports the Associated Press (AP).

IDC Releases EMS Industry Forecast 2009-2013 (Nov 30, 2009)

Michael J. Palma, senior research analyst in the semiconductors team at IDC, published the “EMS Industry Forecast 2009–2013: Hints of Recovery” report. This IDC update provides IDC's electronic manufacturing services (EMS) industry forecast from 2008 through 2013. It includes forecasts for the EMS and original design manufacturing (ODM) sectors, product segments, and regions. This update also reviews the state of the industry and core forecast scenario and assumptions.

Henderson Forecast: Computer Equipment (Nov 30, 2009)

Though the recession has virtually decimated the computer industry, Henderson Ventures analysts predict double-digit computer industry gains by 2011. This year, the traditional Q’04 holiday bump in sales is expected to reappear, after being waylaid last year by the onset of the financial crisis.

PCB Fab Partnership: Electronic Interconnect Collaborates with Flex Interconnect Technologies (Nov 25, 2009)

PCB design, engineering, and manufacturing provider Electronic Interconnect (EI) will engage in a cooperative agreement with Flex Interconnect Technologies (FIT — Milpitas, CA) to jointly provide a wider range of PCB products. EI specializes primarily in rigid PCB types, while FIT provides design and manufacturing to final assembly of flexible circuits, rigid-flex, and HDI flex.

Printing Videos
The A-Line at IPC Midwest produces a PCB assembly with jet solder printing, dual-head pick-and-place, reflow, and depanelization.; Assembly; cab; ipc; IPC Midwest; Juki; Mydata; Senju; smt; The Morey Corp; Steve Pollock, sales manager at Essemtec, demostrates the printer, pick-and-place, and lead-free convection reflow oven that comprise their turnkey line.; complete line; Essemtec; lead-free reflow; manufacturing line; pick and place; printer; reflow; SMTAI; turnkey manufacturing; John Byers, Asymtek, debuts the SelectCoat SL940 dispensing system for conformal coatings and other materials. ; apex; Asymtek; conformal coating; dispense; dispensing; vision; Dick Johnson, DEK, walks Gail Flower through the Instinctiv V9 machine optimization software.; apex; DEK; Instinctiv V9; machine optimization; Printing; software; Mike Foster of Dynatech/Samsung walks Gail Flower through the SM series complete SMT line at the show. Featured equipment includes screen printer, pick-and-place systems, and more.; apex; Dynatech; pick-and-place; printer; samsung; smt line; Asymtek's Greg Wood, vice president of sales, talks to Gail Flower at Semicon West 2008.; Semicon West 2008 asymtek packaging; Jim Price of Sony Manufacturing Systems America debuts the SI-P850 screen printer and SI-V200 AOI system to North American assemblers at the show.; AOI; inspection; Printing; screen printer; Sony Manufacturing Systems; Frank Piracci, Asymtek, shows the S822 dual-lane shuttle for higher-throughput CSP underfill.; apex; Asymtek; chipscale package; CSP; dispensing; underfill; Demonstrations and discussions of next-generation printers, printing software, dispensers, conformal coatings, stencils, and other dispensing technologies.
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