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Materials Articles
Emerging Materials for EMS: Modifiable Silicone Foams Reduce Contamination (Oct 27, 2009)

Silicone foams are highly adaptable products for potting, gasketing, and encapsulation. Michelle Velderrain, NuSil Technology, explains the benefits of silicone foams, and how their materials properties can be tailored for processability, chemical resistance, temperature cycling, vibration dampening, and other functions.

New Thermal Management Products (Oct 13, 2009)

Whether metal preforms, two-part epoxies, gap filler pads, films, or other materials, these products are designed to dissipate heat away from thermally sensitive or high-heat components to heatsinks, copper planes, the air, or other thermal interface materials (TIMs).

Surface Mount Technology Industry News
Productronica Show Preview: Materials (Oct 27, 2009)

The Munich Electronics Summit and productronica will take place November 10–13 in Munich. Following are consummables for component attach, cleaning, and more, including laminates, solders, adhesives, dispensing cartridges, cleaning formulae, etc., that will be featured at the show.

Productronica Show Preview: Equipment (Oct 27, 2009)

The Munich Electronics Summit and productronica will take place November 10–13 in Munich. Following are exhibitor previews for the equipment at the show, including inspection systems, programmers, screen printers and tooling, pick-and-place systems, and more.

SME Releases the Kaizen Event Fieldbook (Oct 26, 2009)

The Society of Manufacturing Engineers (SME) published Kaizen Event Fieldbook: Foundation, Framework & Standard Work for Effective Events, which details the strategies, tools, and techniques necessary for conducting effective lean events

Endicott Interconnect Fabricates Set-up PCB for Space Application (Oct 26, 2009)

Endicott Interconnect Technologies Inc. (EI) delivered a complex, ruggedized printed circuit board (PCB) to STI Electronics Inc. (STI), designed to meet the unique temperature, reliability, performance, vibration, and G-force requirements for a space application. EI, with support from STI, developed a unique method of fabricating a double-sided PCB with a single-tier cavity on a 50-mil copper core.

ZVEI Launches PCB and Electronic Systems Association (Oct 23, 2009)

ZVEI PCB and Electronic Systems founded by the current members of the Association of PCB Industry (VdL) and members of the PCB, integrated circuit (IC), and component industry in the ZVEI Association for Electronic Components and Systems. Wolfgang Bochtler (Freudenberg Mektec Europe GmbH) will officially begin the association’s work as its elected chairman.

Printing Videos
The A-Line at IPC Midwest produces a PCB assembly with jet solder printing, dual-head pick-and-place, reflow, and depanelization.; Assembly; cab; ipc; IPC Midwest; Juki; Mydata; Senju; smt; The Morey Corp; Steve Pollock, sales manager at Essemtec, demostrates the printer, pick-and-place, and lead-free convection reflow oven that comprise their turnkey line.; complete line; Essemtec; lead-free reflow; manufacturing line; pick and place; printer; reflow; SMTAI; turnkey manufacturing; John Byers, Asymtek, debuts the SelectCoat SL940 dispensing system for conformal coatings and other materials. ; apex; Asymtek; conformal coating; dispense; dispensing; vision; Dick Johnson, DEK, walks Gail Flower through the Instinctiv V9 machine optimization software.; apex; DEK; Instinctiv V9; machine optimization; Printing; software; Mike Foster of Dynatech/Samsung walks Gail Flower through the SM series complete SMT line at the show. Featured equipment includes screen printer, pick-and-place systems, and more.; apex; Dynatech; pick-and-place; printer; samsung; smt line; Asymtek's Greg Wood, vice president of sales, talks to Gail Flower at Semicon West 2008.; Semicon West 2008 asymtek packaging; Jim Price of Sony Manufacturing Systems America debuts the SI-P850 screen printer and SI-V200 AOI system to North American assemblers at the show.; AOI; inspection; Printing; screen printer; Sony Manufacturing Systems; Frank Piracci, Asymtek, shows the S822 dual-lane shuttle for higher-throughput CSP underfill.; apex; Asymtek; chipscale package; CSP; dispensing; underfill; Demonstrations and discussions of next-generation printers, printing software, dispensers, conformal coatings, stencils, and other dispensing technologies.
Surface Mount Technology White Papers

Featured White Papers

Sustainability Commitment A Key Driver for Product Development
There's a lot of talk about sustainability these days. While some firms have truly embraced a plan to drive toward more environmentally responsible products and ...
Sponsored By:  Henkel Corporation
Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ...
Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
by Brian Toleno, Ph.D., Henkel CorporationIf you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed ...
Sponsored By:  Henkel Corporation

Recent White Papers

Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ...
Sponsored By:  Henkel Corporation
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