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Coating Articles
Conformal Coating New Products (Oct 19, 2009)

New products for electronics coating and encapsulation include halogen-free coatings and adhesives from DYMAX; an IR epoxy cure system from IRphotonics; a tack-free, low-hardness conformal coating from Master Bond; acrylic- and epoxy-based systems from Rudolph Bros.; and a UV/visible-light-curable silicone potting and sealing material from DYMAX.

New Materials: Thermal Interfaces, Encapsulants, Adhesives, and More (Jul 20, 2009)
(July 21, 2009) — Victrex, Huntsman, Wacker Chemie, Dymax, and other companies introduced new materials for electronics assembly, from underfills to thermal greases, glass-filled polymers, halogen-free resins, silicone rubbers, encapsulants, and more.
Surface Mount Technology Industry News
To Reduce E-Waste, Slow the Pace of Electronics Launches (Oct 19, 2009)

Americans buy new cell phones every 18 months; Europeans buy them every 15 months; and the Japanese every 9 months. Global replacement rates for digital cameras range between two and three years. And U.S. businesses replace their PCs every four years. Where do most of these used products go? Directly into the trash. Indeed, in the United States alone, consumers throw away 400 million electronic products each year, according to a report by the Stanford Graduate School of Business.

Flextronics to Build Suzhou, China Facility to Support Computing Manufacturing, R&D; (Oct 16, 2009)

In a signing ceremony held today with Suzhou Wuzhong Economic Development Zone and Jiangsu Wuzhong Export Processing Zone, electronics manufacturing services (EMS) provider Flextronics (Nasdaq: FLEX) announced it will expand its presence in China through the development of a new facility in Wuzhong. The facility will support the growing demand for computing products in China and will include a design center and extended manufacturing capabilities in the Wuzhong Export Processing Zone (WEPZ). The design center will be completed by the end of 2009 and the manufacturing facility is expected to be completed by the end of 2010.

Kyzen Equips Application Laboratory in Penang, Malaysia (Oct 14, 2009)

Cleaning products provider Kyzen plans to add an applications laboratory in its new Penang, Malaysia sales and support office.

ECT, ScanCAD Partner on Process Management Work Instruction Software (Oct 14, 2009)

Everett Charles Technologies (ECT), a Dover Company, finalized a strategic partnership with ScanCAD International, a global supplier of process management tools. This partnership provides for ScanCAD International to exclusively distribute and support the ProWorks process management work instruction software family of products globally within the electronics industry.

Mentor Graphics, Valor Agree to Merge (Oct 13, 2009)

Mentor Graphics Corporation (NASDAQ: MENT) and Valor Computerized Systems Ltd. (Prime Standard: VCR) have signed a definitive merger agreement for Mentor Graphics to acquire Valor.

Printing Videos
The A-Line at IPC Midwest produces a PCB assembly with jet solder printing, dual-head pick-and-place, reflow, and depanelization.; Assembly; cab; ipc; IPC Midwest; Juki; Mydata; Senju; smt; The Morey Corp; Steve Pollock, sales manager at Essemtec, demostrates the printer, pick-and-place, and lead-free convection reflow oven that comprise their turnkey line.; complete line; Essemtec; lead-free reflow; manufacturing line; pick and place; printer; reflow; SMTAI; turnkey manufacturing; John Byers, Asymtek, debuts the SelectCoat SL940 dispensing system for conformal coatings and other materials. ; apex; Asymtek; conformal coating; dispense; dispensing; vision; Dick Johnson, DEK, walks Gail Flower through the Instinctiv V9 machine optimization software.; apex; DEK; Instinctiv V9; machine optimization; Printing; software; Mike Foster of Dynatech/Samsung walks Gail Flower through the SM series complete SMT line at the show. Featured equipment includes screen printer, pick-and-place systems, and more.; apex; Dynatech; pick-and-place; printer; samsung; smt line; Asymtek's Greg Wood, vice president of sales, talks to Gail Flower at Semicon West 2008.; Semicon West 2008 asymtek packaging; Jim Price of Sony Manufacturing Systems America debuts the SI-P850 screen printer and SI-V200 AOI system to North American assemblers at the show.; AOI; inspection; Printing; screen printer; Sony Manufacturing Systems; Frank Piracci, Asymtek, shows the S822 dual-lane shuttle for higher-throughput CSP underfill.; apex; Asymtek; chipscale package; CSP; dispensing; underfill; Demonstrations and discussions of next-generation printers, printing software, dispensers, conformal coatings, stencils, and other dispensing technologies.
Surface Mount Technology White Papers

Featured White Papers

Sustainability Commitment A Key Driver for Product Development
There's a lot of talk about sustainability these days. While some firms have truly embraced a plan to drive toward more environmentally responsible products and ...
Sponsored By:  Henkel Corporation
Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ...
Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
by Brian Toleno, Ph.D., Henkel CorporationIf you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed ...
Sponsored By:  Henkel Corporation

Recent White Papers

Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ...
Sponsored By:  Henkel Corporation
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