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Research and Markets Releases Bare PCB Manufacturing Report (Sep 10, 2009)

Research and Markets' "Bare Printed Circuit Board Manufacturing Industry" report for Q'02 2009 is a comprehensive market research guide on the industry. It provides the latest information on the industry's key financial data, competitive landscape, cost and pricing, and trends during the current economic recession.

IBM Awards Endicott Interconnect Supercomputing Contract (Sep 10, 2009)

Endicott Interconnect Technologies Inc. (EI) was sole sourced on IBM’s next-generation supercomputing program, providing PCBs, board-level assemblies, and testing.

Electronics Supply Chain: Slightly More Optimistic, Still in Recession (Sep 8, 2009)

(September 8, 2009) SAN JOSE, CA — published findings from its survey of nearly 300 electronics supply chain decision makers on the current business environment, volumes and expectations, and pricing trends. The results show a meaningful increase in optimism about the future, yet still no sign of irrational exuberance, or even a serious recovery before the end of 2009. The current market situation is not greatly changed since April 2009.

Almost 40% of Manufacturers Predict Revenue Increase in H'02 2009 (Sep 8, 2009)

(September 8, 2009) CHICAGO — Prime Advantage, a buying consortium for mid-sized industrial manufacturers, announced the findings of its fourth Prime Advantage Group Outlook (GO) Survey, revealing the top economic concerns of mid-sized industrial manufacturers for the remainder of 2009. The study results reflect a growing sense of optimism returning to the manufacturing sector, in terms of improved revenues, customer demand, and hiring expectations.

PCB Production Reports: IPC Market Research (Sep 8, 2009)

(September 8, 2009) BANNOCKBURN, Ill. — The forecast for North American PCB production is down for 2009, but shows growth resuming in 2010. North American PCB manufacturers managed to push sales growth in 2008 slightly above 2007 levels, despite declines in the market for PCBs and PCB production in North America. Rigid PCB and flexible circuit producers have very different expectations for sales growth in 2009. These analyses come from four annual studies from IPC Market Research.

Juki Opens Western U.S. Headquarters (Sep 8, 2009)

(September 8, 2009) MORRISVILLE, NC — Juki Automation Systems (JAS) opened its new western U.S. headquarters in Fremont, CA, gaining more space for customer training, demos of selective soldering and component placement offerings, warehousing and shipping, and other operations.

Bliss Opens Lean Manufacturing Solutions Center (Sep 4, 2009)
(September 4, 2009) MILPITAS, CA — Bliss Industries Inc., provider of material handling carts and racks for PCB assembly, opened its Lean Manufacturing Solutions Center at its headquarters in Milpitas.
EMS Expansions: NBS Adds SMT Line; Sunburst Adds ICT (Sep 4, 2009)

September 4, 2009) — EMS provider NBS installed an additional SMT line at its headquarters facility in Santa Clara, CA, bringing in its fourth fully automated line there. Sunburst EMS, a high-mix/low- to medium-volume electronics manufacturing services provider, added a GenRad GR 2286 in-circuit test (ICT) system to its manufacturing test capabilities.

Valor Premiers Customer Support Portal (Sep 4, 2009)
(September 4, 2009) RANCHO SANTA MARGARITA, CA — Valor Computerized Systems Inc. launched a dedicated "Customer Support Portal," designed to provide customers with an advanced level of assistance, allowing them to log new support cases, and check and updated existing support cases. The portal is also designed to let customers search the Valor knowledge base for solutions and communicate via forums.
SMTAI Products Preview I (Sep 4, 2009)
The SMTA will celebrate its 25th anniversary at SMTA International (SMTAI) this year, October 4–8 in San Diego. The exhibition will include more than 80 companies. This product preview includes X-ray inspection from Dage; rework from Finetech; reflow inspection from KIC; cleaning from Kyzen; automation tools from PROMATION; and pick-and-place from Manncorp and Juki. SMT will cover SMTAI news and products throughout September and October.
IPC Midwest: Free Forums, Standards Development, and Other Conference Highlights (Sep 3, 2009)
(September 3, 2009) SCHAUMBURG, IL — IPC Midwest's Conference Program and Standards Development Meetings, September 20–24, will cover reliability and failure analysis, cleaning and alternatives, solder alloys, printing processes, and other relevant SMT assembly topics. Presenters include Chris Mahanna, Robisan Laboratory; Mike Bixenman, Ph.D., Kyzen; S. Manian Ramkumar, RIT; and many others from global companies.
A Cautionary Tale: Outsourcing and the Boeing 787 Dreamliner (Sep 3, 2009)
The Boeing Dreamliner is years behind schedule, and the company replaced the head of its passenger plane business, naming Jim Albaugh, from Boeing's defense unit, as CEO of Boeing Commercial Airplanes. To save money and minimize its financial risk, Boeing outsourced not just Dreamliner production, but aerospace design and engineering in ways it had never done before, reports NPR's Wendy Kaufman.
IPC Midwest Exhibitor Preview I (Sep 1, 2009)
(September 1, 2009) SCHAUMBURG, IL — Following are some of the many new and flagship products that will be exhibited later this month at IPC Midwest, September 23–24 in Schaumburg. The exhibition will include AOI systems from Mirtec and YESTech, selective soldering tools from Juki and ACE Production Technologies, solder paste inspection (SPI) from CyberOptics, and printing platforms from DEK, among a host of other exhibits.
EMS Providers Jaltek, Zollner, and Zurvahn Expand Services, Facilities (Sep 1, 2009)
(September 1, 2009) — Zurvahn expanded its Zurvahn Technology Center (ZTC) to provide engineering design services and quick-turn prototyping; Zollner Elektronik and EIT partnered to maximize U.S.-based offerings and global manufacturing; and Jaltek IDMS invested in new SMT, reflow, and inspection equipment for more flexibility in prototyping.
IPC Midwest: A-Line Live Assembly (Aug 31, 2009)

(August 31, 2009) SCHAUMBURG, IL — For the second year, IPC will run an SMT assembly line at IPC Midwest, September 23–24 in Schaumburg. Follow a product from screen printing to component mounting (through hole and surface mount), and then through reflow, learning about the processes, equipment (and end-item cleaning) that were used to manufacture the assembly from experts on the tools.

Copper Hits Lows on Equity Drop (Aug 31, 2009)
(August 31, 2009) NEW YORK — Reuters reports that U.S. copper futures extended a pull-back from last week's 11-month highs on August 31, as a sharp plunge in Chinese and U.S. equity markets curbed economic recovery hopes, and a firmer dollar combined to drag prices down to one-week lows.
IPC Sees Industry Strengthening Out of Recession (Aug 31, 2009)
(August 31, 2009) BANNOCKBURN, IL — IPC found in Survival Strategies and Success Measures in the Electronics Industry how companies are weathering the recession, the recession's impact on their relationships with suppliers, and how they measure success. The survey includes data from electronics OEMs, EMS companies, and PCB manufacturers and suppliers.
Taiwanese PCB Makers Post Solid Profits in H'01 2009 (Aug 28, 2009)
(August 28, 2009) TAIPEI, Taiwan — Strongly rebounding demand for notebook PCs and liquid crystal display (LCD) TVs worldwide is driving Taiwanese printed circuit board (PCB) makers to rev up production, according to China Economic News Service (CENS). Taiwan's PCB fabricators have effectively fueled their profits for the first half of this year since the second quarter.
SME and Purdue Debut Green Certification Program (Aug 27, 2009)
(August 27, 2009) DEARBORN, MI — The Society of Manufacturing Engineers (SME) is collaborating with Purdue University's Technical Assistance Program to develop the Green Manufacturing Specialist Certificate. The curriculum focuses on such topics as sustainable manufacturing, energy efficiency, water conservation, recycling, design for the environment (DfE), and pollutants.
IPC's July Book-to-bill Stays Just Above Parity (Aug 26, 2009)
(August 26, 2009) BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries announced today the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The combined (rigid and flex) industry book-to-bill ratio in July 2009 retreated to 1.07. Booking to billing ratios for rigid PCBs stayed above parity, though the ratio for flexible circuits dropped below 1.00
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Volume 6, Issue 2
June 2009
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