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PCB Design Articles
New Standard: IPC-2152 "Standard for Determining Current-carrying Capacity in Printed Board Design" (Oct 13, 2009)

IPC — Association Connecting Electronics Industries released IPC-2152, "Standard for Determining Current-Carrying Capacity in Printed Board Design." The 97-page document sets a standard for determining the appropriate sizes of internal and external conductors as a function of the current-carrying capacity required and the acceptable conductor temperature rise.

PCB Fab in a Recession: Lean, Web-based Ops (Jul 27, 2009)
By Pratish Patel, Electronic Interconnect (EI)
PCB fabrication is a competitive and price-driven business with slim margins. One U.S.-based supplier has a lean methodology to thrive and grow even in tough times. This article covers the fabricator's approach to business and the marketplace with the application of lean manufacturing principles and modern communications.
Surface Mount Technology Industry News
Flextronics to Build Suzhou, China Facility to Support Computing Manufacturing, R&D; (Oct 16, 2009)

In a signing ceremony held today with Suzhou Wuzhong Economic Development Zone and Jiangsu Wuzhong Export Processing Zone, electronics manufacturing services (EMS) provider Flextronics (Nasdaq: FLEX) announced it will expand its presence in China through the development of a new facility in Wuzhong. The facility will support the growing demand for computing products in China and will include a design center and extended manufacturing capabilities in the Wuzhong Export Processing Zone (WEPZ). The design center will be completed by the end of 2009 and the manufacturing facility is expected to be completed by the end of 2010.

Kyzen Equips Application Laboratory in Penang, Malaysia (Oct 14, 2009)

Cleaning products provider Kyzen plans to add an applications laboratory in its new Penang, Malaysia sales and support office.

ECT, ScanCAD Partner on Process Management Work Instruction Software (Oct 14, 2009)

Everett Charles Technologies (ECT), a Dover Company, finalized a strategic partnership with ScanCAD International, a global supplier of process management tools. This partnership provides for ScanCAD International to exclusively distribute and support the ProWorks process management work instruction software family of products globally within the electronics industry.

Mentor Graphics, Valor Agree to Merge (Oct 13, 2009)

Mentor Graphics Corporation (NASDAQ: MENT) and Valor Computerized Systems Ltd. (Prime Standard: VCR) have signed a definitive merger agreement for Mentor Graphics to acquire Valor.

Participate at APEX 2010 (Oct 12, 2009)

IPC is currently accepting abstracts from students, researchers, industry experts, and engineers in all areas of electronics and solar cell assembly for the 2010 IPC APEX Expo, April 6–8, 2010, at the Mandalay Bay Resort & Convention Center, Las Vegas. Abstracts are due in January 2010.

Design Videos
Vern Solberg, STI ? Madison, speaks on miniaturization, such as wafer-level packaging (WLP) and chip on board (COB).; BGA; Cob; Flip Chip; Miniaturization; smt; Vern Solberg; Wireless Handsets; Gene Dunn, Panasonic Factory Solutions of America, examines thin-die packaging issues that EMS providers will need to consider in board layout for bend possibilities, pick-and-place systems for picking force, and reflow for overheat concerns. ; board design; Fragile Components; Fragile Packages; Miniaturization; panasonic; pick-and-place; reflow; smt; Thin Die; James Holova, BPM Microsystems, talks about device programming product lines. He describes the benefits of the Flashstream technology for flash device programming. ; BPM; device programmer; flash; flashstream; programming; SMTAI; Video 1. The video shows an integrated RF design flow using Mentor Graphics design tools in an integrated design flow with the Advanced Design System RF and microwave design solution from Agilent Technologies.; Agilent Technologies; Mentor Graphics; mixed-signal design; RF Design; Tim Nolte, BPM Microsystems, sees the device programming market growing, based on increased flash memory usage.; apex; BPM; device programming; Flash memory; flashstream; vector engine; One of Amkor's latest package offerings, FusionQuad, protects the package while making interconnects easier for fine pitch connections to the PCB.; advanced package; AmKor; BGA; fine pitch package; FusionQuad; new package style; PCB package; quad flatpack; SATS provider package; SMT explores the latest advances in design for manufacturing (DfM), design for test (DfT), DfX, layout, design software, CAD/CAM. Programmable devices and device programming also are featured.
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Sustainability Commitment A Key Driver for Product Development
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