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Design Articles
New Design Products (Nov 3, 2009)

Following are design software packages and upgrades that simplify, automate, and otherwise improve PCB design, design for excellence (DfX), and other aspects of new product introduction.

New Standard: IPC-2152 "Standard for Determining Current-carrying Capacity in Printed Board Design" (Oct 13, 2009)

IPC — Association Connecting Electronics Industries released IPC-2152, "Standard for Determining Current-Carrying Capacity in Printed Board Design." The 97-page document sets a standard for determining the appropriate sizes of internal and external conductors as a function of the current-carrying capacity required and the acceptable conductor temperature rise.

Surface Mount Technology Industry News
DEK and Stencil Franchisee AGI Demonstrate Advanced Printing Technology (Dec 1, 2009)

 Showcasing the latest expansion of its global stencil network, DEK and new franchisee AGI Corporation opened the doors of their manufacturing operation to local customers in the Americas. Attended by both leading EMS and OEM electronics firms and Huntsville Mayor Tommy Battle, the DEK-AGI Open House was designed to highlight the company’s stencil production expertise. 

Lenovo Reaquiring Mobile Phone Unit (Nov 30, 2009)

Personal computer maker Lenovo Group said Friday it is joining the race to develop products that link phones and PCs by buying back a mobile phone business that it sold last year, reports the Associated Press (AP).

IDC Releases EMS Industry Forecast 2009-2013 (Nov 30, 2009)

Michael J. Palma, senior research analyst in the semiconductors team at IDC, published the “EMS Industry Forecast 2009–2013: Hints of Recovery” report. This IDC update provides IDC's electronic manufacturing services (EMS) industry forecast from 2008 through 2013. It includes forecasts for the EMS and original design manufacturing (ODM) sectors, product segments, and regions. This update also reviews the state of the industry and core forecast scenario and assumptions.

Henderson Forecast: Computer Equipment (Nov 30, 2009)

Though the recession has virtually decimated the computer industry, Henderson Ventures analysts predict double-digit computer industry gains by 2011. This year, the traditional Q’04 holiday bump in sales is expected to reappear, after being waylaid last year by the onset of the financial crisis.

PCB Fab Partnership: Electronic Interconnect Collaborates with Flex Interconnect Technologies (Nov 25, 2009)

PCB design, engineering, and manufacturing provider Electronic Interconnect (EI) will engage in a cooperative agreement with Flex Interconnect Technologies (FIT — Milpitas, CA) to jointly provide a wider range of PCB products. EI specializes primarily in rigid PCB types, while FIT provides design and manufacturing to final assembly of flexible circuits, rigid-flex, and HDI flex.

Current Issue
SMT
Volume 23, Issue 6
November 2009
Design Videos
Vern Solberg, STI ? Madison, speaks on miniaturization, such as wafer-level packaging (WLP) and chip on board (COB).; BGA; Cob; Flip Chip; Miniaturization; smt; Vern Solberg; Wireless Handsets; Gene Dunn, Panasonic Factory Solutions of America, examines thin-die packaging issues that EMS providers will need to consider in board layout for bend possibilities, pick-and-place systems for picking force, and reflow for overheat concerns. ; board design; Fragile Components; Fragile Packages; Miniaturization; panasonic; pick-and-place; reflow; smt; Thin Die; James Holova, BPM Microsystems, talks about device programming product lines. He describes the benefits of the Flashstream technology for flash device programming. ; BPM; device programmer; flash; flashstream; programming; SMTAI; Video 1. The video shows an integrated RF design flow using Mentor Graphics design tools in an integrated design flow with the Advanced Design System RF and microwave design solution from Agilent Technologies.; Agilent Technologies; Mentor Graphics; mixed-signal design; RF Design; Tim Nolte, BPM Microsystems, sees the device programming market growing, based on increased flash memory usage.; apex; BPM; device programming; Flash memory; flashstream; vector engine; One of Amkor's latest package offerings, FusionQuad, protects the package while making interconnects easier for fine pitch connections to the PCB.; advanced package; AmKor; BGA; fine pitch package; FusionQuad; new package style; PCB package; quad flatpack; SATS provider package; SMT explores the latest advances in design for manufacturing (DfM), design for test (DfT), DfX, layout, design software, CAD/CAM. Programmable devices and device programming also are featured.
Surface Mount Technology White Papers

Featured White Papers

Sustainability Commitment A Key Driver for Product Development
There's a lot of talk about sustainability these days. While some firms have truly embraced a plan to drive toward more environmentally responsible products and ...
Sponsored By:  Henkel Corporation
Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ...
Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
by Brian Toleno, Ph.D., Henkel CorporationIf you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed ...
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Recent White Papers

Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ...
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SMT Blog
by SMT Magazine

SMT Magazine's editorial team discusses industry events, trends and important news for electronics manufacturers, IDMs, OEMs and related companies.

Eastern European Near-sourcing on the Rise

Much has been made of the attendance numbers at productronica 2009 this year in Munich, Germany. As economic reports have trumpeted a better 2010, and electronics manufacturers have started to see a ramp in RFQs and orders, productronica’s attendance...

IPC Midwest: Friends, Fellowship, and Live SMT Assembly

It was a better-than-expected IPC Midwest tradeshow and conference in Schaumburg, IL this September. The A-Line live electronics assembly line attracted interest as each piece of automated equipment performed its task to build a mixed-assembly board with...

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