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PCB Assembly Articles
Products for PCB and Package Fabrication (Nov 23, 2009)

These products and services include micromachining, via drilling, imaging, PCB singulation, and parts sourcing, all for the fabrication of advanced PCBs, substrates, and other structures. Laser platforms, microwashers, laser-free systems, routers, and other approaches are featured. A parts sourcing service brings together bare PCB tooling and fabrication from international partners.

One Year On: An Interview with Assembleon CEO André Papoular (Nov 23, 2009)

André Papoular started with Assembleon about one year ago, though he’s been with parent company Philips for about 29 years, in business management for components, systems and finished products. He’s joined the electronics assembly equipment market at a tough economic time, but Papoular sees this as an opportunity to focus the industry on the way forward, identifying signals of opportunity. The company introduced a printing system at productronica 2009, and also announced a collaboration with Valor to integrate their equipment into a complete suite of software and tools for electronic equipment assembly. These will automate machine-, line- and factory-level workflows and business processes. SMT sat down with the Assembléon team during productronica 2009 in Munich to assess where the company is and where they see placement technology headed.

New Products for Component Placement: Chipshooters, Kitting, Pick-and-place and More (Nov 9, 2009)

APS Novastar introduces off-line placement programming; Toshiba Teli America debuts a high-speed/high-precision machine vision system for pick and place; Universal Instruments intros a line management software package for new and existing component placement machines; Production Solutions offers a center board support; and Manncorp debuts a lower-cost pick-and-place option for prototyping or incorporation on high-volume lines.

New Products: PCBs, Connectors, and Components (Sep 15, 2009)

These connectors, ESD protection components, new pulse resistor technologies, capacitors, and other bill of materials (BOM) elements are new from Tyco, Cornell Dubilier, Molex, Hirose, Spectrum Control, Electronic Interconnect, Murata, Phoenix Contact, Printed Circuits Inc., and The Würth Elektronik Group.

New Products in Component Placement: Pick-and-Place Systems, Heads, and Tooling (Jul 6, 2009)
Following is a product preview for the new MultiStar pick-and-place head, as well as new placement system SIPLACE SX and software, from SIPLACE Electronics Assembly Systems (SEAS). Also highlighted is the feeder and inspection conveyor package for Manncorp's MC-391 in-line dual-head pick-and-place system.
Surface Mount Technology Industry News
Applied Nanotech Selected to Develop Tin Whiskers Remediation Techniques (Nov 23, 2009)

Applied Nanotech Holdings Inc. (OTC BB: APNT) was selected by the U.S. Missile Defense Agency (MDA) to receive an award of approximately $500,000 for the development of non-contact methods for mitigation of tin whiskers from electronic devices. ANI will partner with the University of Maryland’s Center for Advanced Life Cycle Engineering (CALCE) on this project.

Webinar Available on REACH (Nov 23, 2009)

PTC and Tech-Clarity presented a webcast, "Prepare Your Products - and Your Business - for REACH," which reviews recent developments with the REACH regulation, how products and businesses will be impacted, and how leading companies are responding to the REACH challenge despite limited time and resources. Speakers are Jim Brown, president, Tech-Clarity and John Fox, director, product and market strategy, PTC.

Conformal Coating Webinar Available for Download (Nov 20, 2009)

DYMAX Corporation recently hosted a webinar, “Conformal Coating at the Speed of Light: UV Conformal Coating from Start to Finish.” The webinar focuses on cost savings of UV and how to qualify and maintain an effective UV conformal coating process.

November EMS Indicators Report Released (Nov 19, 2009)

Charlie Barnhart & Associates LLC released its Leading Indicators report for November 2009. The report includes latency factors, such as global cost of labor, corporate costs by EMS type, and mark-up percent by volume/sector. Hysteretic factors include geographic pacing, sector pacing, capacity utilization by geography, and solution cycle by EMS type. Finally, probability factors covered include risk constants by geography.

TT Electronics Targets Medical Equipment Manufacturers (Nov 18, 2009)

TT electronics’ component divisions — AB Mikroelektronik, BI Technologies, IRC, OPTEK Technology, Semelab, TT ims and Welwyn — are highlighting a range of products and services for the medical market. From passive components to optoelectronics and semiconductors, TT electronics’ products are being specified for a number of applications in medical equipment. In addition to components, TT electronics also provides complete solutions through advanced manufacturing services for medical systems, including design support, application engineering assistance, and advanced testing for medical electronics.

Assembly Videos
The A-Line at IPC Midwest produces a PCB assembly with jet solder printing, dual-head pick-and-place, reflow, and depanelization.; Assembly; cab; ipc; IPC Midwest; Juki; Mydata; Senju; smt; The Morey Corp; Gene Dunn, Panasonic Factory Solutions of America, examines thin-die packaging issues that EMS providers will need to consider in board layout for bend possibilities, pick-and-place systems for picking force, and reflow for overheat concerns. ; board design; Fragile Components; Fragile Packages; Miniaturization; panasonic; pick-and-place; reflow; smt; Thin Die; Jacques Coderre, Unovis Solutions, presents "Assembly Evolution as Semiconductor and Circuit Board Converge." ; Co-design; convergence; Embedded Components; Flip Chip; packaging; smt; Unovis; David Geiger, Flextronics International, explains how EMS assemblers implement new packages in their processes.; Bare Die; ems; Flextronics; new packages; Pop; SATS/EMS; smt; stacked packages; Bob Black, president, Juki Corporation, demos their range of flexible/high-speed placement systems.; component placement; high-speed placement; Juki; odd-form components; pick-and-place; SMTAI; Jos Brehler, Totech, discusses lead-free in the U.S. and the importance of MSD control using the Superdry dry cabinet.; apex; component drying; dry cabinets; lead-free; moisture-sensitive devices; MSD; Totech; Steve Pollock, sales manager at Essemtec, demostrates the printer, pick-and-place, and lead-free convection reflow oven that comprise their turnkey line.; complete line; Essemtec; lead-free reflow; manufacturing line; pick and place; printer; reflow; SMTAI; turnkey manufacturing; Bob Douglas, president, Inovaxe, tours the INOCART-MSD sensitive-component advanced storage system, with separated cells and component tracking.; component storage; component tracking; INOCART; Inovaxe; moisture sensitive devices; MSD; parts handling; SMTAI; traceability; Tom Mealey, co-owner, Virtual Industries, operates manual, battery-powered, and plug-in vacuum tweezers for handling SMDs and odd-form components.; components; moisture-sensitive devices; MSDs; placement; rework; SMD handling; vacuum tweezers; Jim Price of Sony Manufacturing Systems America debuts the SI-P850 screen printer and SI-V200 AOI system to North American assemblers at the show.; AOI; inspection; Printing; screen printer; Sony Manufacturing Systems; Brian Duffey, MYDATA, introduces the MY100 DX family of split-axis, linear-motor component placement systems with vibration-free feeding for high component mixes.; apex; chip shooter; component placement; feeders; MY100; Mydata; pick and place; Hiroaki Kobayashi, Seika Machinery, introduces their conveyors and PCB loaders made in Korea with Japanese parts.; apex; assembly tools; conveyors; PCB handling; seika; Mike Foster of Dynatech/Samsung walks Gail Flower through the SM series complete SMT line at the show. Featured equipment includes screen printer, pick-and-place systems, and more.; apex; Dynatech; pick-and-place; printer; samsung; smt line; Bob Douglas, Inovaxe, demos their MSD handling system for managing editor Meredith Courtemanche.; apex; component storage; Dry box; Inovaxe; lead-free; Materials handling; MSD; SMT tours the assembly capabilities of pick-and-place and chip shooter manufacturers, including mixed assembly placement, thru-hole, placing miniaturized passives, and PCB and component handling. Tooling also is featured.
Surface Mount Technology White Papers

Featured White Papers

Sustainability Commitment A Key Driver for Product Development
There's a lot of talk about sustainability these days. While some firms have truly embraced a plan to drive toward more environmentally responsible products and ...
Sponsored By:  Henkel Corporation
Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ...
Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
by Brian Toleno, Ph.D., Henkel CorporationIf you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed ...
Sponsored By:  Henkel Corporation

Recent White Papers

Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ...
Sponsored By:  Henkel Corporation
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