At IPC APEX EXPO 2010, Michael Moreau of Christopher Associates demonstrates a modular, flexible circuit board panel cleaner. This panel cleaner can remove lint and other contaminants from both sides of a flex circuit panel, one side of a panel with SMT components on the other side, etc.
In this video, a Siemens technician adds capacity to a Siemens SX pick-and-place machine at APEX 2010. The many reasons to rent capacity, rather than purchase the maximum throughput/capacity on a system or upgrade traditionally, are discussed. Additional specifications of the SX placement machine are covered.
This report from Research and Markets analyzes the worldwide markets for flex PCBs by end-use markets and production region (2007-2015). It includes an introduction to flex circuits, including PCB types, materials used to make flexible circuits, and the benefits of using flex over rigid PCBs.
With changes in software, nozzles, drive systems, feeders, and other elements, pick-and-place systems can place bare die or LEDs, perform high-speed IC shooter functions, handle large connectors and other oddforms, etc. New products come from Siemens Electronics Assembly Systems, Count On Tools, Universal Instruments, Essemtec, MYDATA, Assembleon, and IPTE.
Research and Markets released the “Global Surface Mount Technology Placement Equipment Markets” report. The global SMT placement equipment market includes approximately 40 companies that offer a variety of purchase options to the two main end users of the equipment: original equipment manufacturers (OEMs) and contract electronics manufacturers (CEMs). This report discusses gantry and turret pick-and-place systems.
IPC released the E revision of IPC-A-610, "Acceptability of Electronic Assemblies." IPC’s most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
Siemens announced the SIPLACE SiCluster Professional software to optimize placement machine set up; Manncorp introduced 7700-FV prototyping/low-volume pick-and-place system for OEMs; and Assembléon debuted the YS24 high-mix, dual-sided pick-and-place machine from Yamaha.
Mumtaz Y. Bora, Peregrine Semiconductor, defines MSDs, relevant standards, and where the industry is headed in the handling of moisture sensitive components and circuit boards. The IPC D-35 committee is working to release a standard for moisture sensitivity control guidelines for PWBs.
These new products include cables, connectors, a through-hole insertion system, device cooling hardware, and a report on the odd-form/connector industry, as well as a component order calculator, and more.
These products and services include micromachining, via drilling, imaging, PCB singulation, and parts sourcing, all for the fabrication of advanced PCBs, substrates, and other structures. Laser platforms, microwashers, laser-free systems, routers, and other approaches are featured. A parts sourcing service brings together bare PCB tooling and fabrication from international partners.
André Papoular started with Assembleon about one year ago, though he’s been with parent company Philips for about 29 years, in business management for components, systems and finished products. He’s joined the electronics assembly equipment market at a tough economic time, but Papoular sees this as an opportunity to focus the industry on the way forward, identifying signals of opportunity. The company introduced a printing system at productronica 2009, and also announced a collaboration with Valor to integrate their equipment into a complete suite of software and tools for electronic equipment assembly. These will automate machine-, line- and factory-level workflows and business processes. SMT sat down with the Assembléon team during productronica 2009 in Munich to assess where the company is and where they see placement technology headed.
APS Novastar introduces off-line placement programming; Toshiba Teli America debuts a high-speed/high-precision machine vision system for pick and place; Universal Instruments intros a line management software package for new and existing component placement machines; Production Solutions offers a center board support; and Manncorp debuts a lower-cost pick-and-place option for prototyping or incorporation on high-volume lines.
Tape-and-reel component packaging can determine the speed and operation effectiveness of pick-and-place feeders and equipment. Curtis Maynes, 3M Electronic Solutions Division, explains the types of carrier and cover tapes, how they affect pick-and-place operation, and what is available on the market for better feeder speed, higher accuracy with miniaturized components, and ESD protection.
Rogers Corp. introduced a new laminate technology for high-frequency amplifier designs; the Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, presented “Glass as a Substrate for High Density Interconnects,” asserting a new packaging substrate opinion; and IPC — Association Connecting Electronics Industries released revision C of IPC-4101, “Specification for Base Materials for Rigid and Multilayer Printed Boards.”
These connectors, ESD protection components, new pulse resistor technologies, capacitors, and other bill of materials (BOM) elements are new from Tyco, Cornell Dubilier, Molex, Hirose, Spectrum Control, Electronic Interconnect, Murata, Phoenix Contact, Printed Circuits Inc., and The Würth Elektronik Group.