Flex Circuit Assembly: Surface Mount Technology and ElectroIQ.com

More Assembly Subtopics

Flex Circuit Assembly Articles
Laminates: New Products and Technologies (Sep 22, 2009)

Rogers Corp. introduced a new laminate technology for high-frequency amplifier designs; the Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, presented “Glass as a Substrate for High Density Interconnects,” asserting a new packaging substrate opinion; and IPC — Association Connecting Electronics Industries released revision C of IPC-4101, “Specification for Base Materials for Rigid and Multilayer Printed Boards.”

Large-area Flexible Electronics Promise High-Volume, Low-Cost Production (May 15, 2009)
By Daniel Gamota, iNEMI
The term large-area flexible electronics encompasses a wide array of devices and applications manufactured on flexible substrates. These products can be fabricated using a full range of materials and processes. One of the most compelling aspects of large-area flexible electronics is that they can be produced using high-volume, low-cost, and R2R processes. This article touches on functional inks, processing platforms, and in-line characterization tools.
Medical Equipments: Flexible Circuits in Hearing Aids (Mar 5, 2009)
By Thomas H. Stearns, Brander International Consultants

Hearing aids were one of the first modern medical electronic devices worn on the patient. These externally mounted devices make use of flex and rigid circuits in highly miniaturized assemblies. Starkey Labs and Sonic Innovations weigh in on this report about flexible PCBs enabling medical advances.
R&D; Initiatives Boost Flex Electronics (Jan 8, 2009)
(January 8, 2009) LONDON — Frost & Sullivan reports that the flexible electronics industry is set to bring about changes in the design and conceptualization of electronics devices in the consumer, medical, and military sectors. The emerging field has implications in reducing costs owing to printed manufacturing techniques developed for volume production.
Research and Markets Releases Flexible PCB Report (Dec 18, 2008)
(December 18, 2008) DUBLIN — Research and Markets put out a report on the market for flex circuits, titled, "Total World Flexible Printed Circuit Board Market." The study covers challenges to the flex PCB industry, drivers, restraints, product segments, technology trends, and other elements.
Surface Mount Technology Industry News
Applied Nanotech Selected to Develop Tin Whiskers Remediation Techniques (Nov 23, 2009)

Applied Nanotech Holdings Inc. (OTC BB: APNT) was selected by the U.S. Missile Defense Agency (MDA) to receive an award of approximately $500,000 for the development of non-contact methods for mitigation of tin whiskers from electronic devices. ANI will partner with the University of Maryland’s Center for Advanced Life Cycle Engineering (CALCE) on this project.

Webinar Available on REACH (Nov 23, 2009)

PTC and Tech-Clarity presented a webcast, "Prepare Your Products - and Your Business - for REACH," which reviews recent developments with the REACH regulation, how products and businesses will be impacted, and how leading companies are responding to the REACH challenge despite limited time and resources. Speakers are Jim Brown, president, Tech-Clarity and John Fox, director, product and market strategy, PTC.

Conformal Coating Webinar Available for Download (Nov 20, 2009)

DYMAX Corporation recently hosted a webinar, “Conformal Coating at the Speed of Light: UV Conformal Coating from Start to Finish.” The webinar focuses on cost savings of UV and how to qualify and maintain an effective UV conformal coating process.

November EMS Indicators Report Released (Nov 19, 2009)

Charlie Barnhart & Associates LLC released its Leading Indicators report for November 2009. The report includes latency factors, such as global cost of labor, corporate costs by EMS type, and mark-up percent by volume/sector. Hysteretic factors include geographic pacing, sector pacing, capacity utilization by geography, and solution cycle by EMS type. Finally, probability factors covered include risk constants by geography.

TT Electronics Targets Medical Equipment Manufacturers (Nov 18, 2009)

TT electronics’ component divisions — AB Mikroelektronik, BI Technologies, IRC, OPTEK Technology, Semelab, TT ims and Welwyn — are highlighting a range of products and services for the medical market. From passive components to optoelectronics and semiconductors, TT electronics’ products are being specified for a number of applications in medical equipment. In addition to components, TT electronics also provides complete solutions through advanced manufacturing services for medical systems, including design support, application engineering assistance, and advanced testing for medical electronics.

Assembly Videos
The A-Line at IPC Midwest produces a PCB assembly with jet solder printing, dual-head pick-and-place, reflow, and depanelization.; Assembly; cab; ipc; IPC Midwest; Juki; Mydata; Senju; smt; The Morey Corp; Gene Dunn, Panasonic Factory Solutions of America, examines thin-die packaging issues that EMS providers will need to consider in board layout for bend possibilities, pick-and-place systems for picking force, and reflow for overheat concerns. ; board design; Fragile Components; Fragile Packages; Miniaturization; panasonic; pick-and-place; reflow; smt; Thin Die; Jacques Coderre, Unovis Solutions, presents "Assembly Evolution as Semiconductor and Circuit Board Converge." ; Co-design; convergence; Embedded Components; Flip Chip; packaging; smt; Unovis; David Geiger, Flextronics International, explains how EMS assemblers implement new packages in their processes.; Bare Die; ems; Flextronics; new packages; Pop; SATS/EMS; smt; stacked packages; Bob Black, president, Juki Corporation, demos their range of flexible/high-speed placement systems.; component placement; high-speed placement; Juki; odd-form components; pick-and-place; SMTAI; Jos Brehler, Totech, discusses lead-free in the U.S. and the importance of MSD control using the Superdry dry cabinet.; apex; component drying; dry cabinets; lead-free; moisture-sensitive devices; MSD; Totech; Steve Pollock, sales manager at Essemtec, demostrates the printer, pick-and-place, and lead-free convection reflow oven that comprise their turnkey line.; complete line; Essemtec; lead-free reflow; manufacturing line; pick and place; printer; reflow; SMTAI; turnkey manufacturing; Bob Douglas, president, Inovaxe, tours the INOCART-MSD sensitive-component advanced storage system, with separated cells and component tracking.; component storage; component tracking; INOCART; Inovaxe; moisture sensitive devices; MSD; parts handling; SMTAI; traceability; Tom Mealey, co-owner, Virtual Industries, operates manual, battery-powered, and plug-in vacuum tweezers for handling SMDs and odd-form components.; components; moisture-sensitive devices; MSDs; placement; rework; SMD handling; vacuum tweezers; Jim Price of Sony Manufacturing Systems America debuts the SI-P850 screen printer and SI-V200 AOI system to North American assemblers at the show.; AOI; inspection; Printing; screen printer; Sony Manufacturing Systems; Brian Duffey, MYDATA, introduces the MY100 DX family of split-axis, linear-motor component placement systems with vibration-free feeding for high component mixes.; apex; chip shooter; component placement; feeders; MY100; Mydata; pick and place; Hiroaki Kobayashi, Seika Machinery, introduces their conveyors and PCB loaders made in Korea with Japanese parts.; apex; assembly tools; conveyors; PCB handling; seika; Mike Foster of Dynatech/Samsung walks Gail Flower through the SM series complete SMT line at the show. Featured equipment includes screen printer, pick-and-place systems, and more.; apex; Dynatech; pick-and-place; printer; samsung; smt line; Bob Douglas, Inovaxe, demos their MSD handling system for managing editor Meredith Courtemanche.; apex; component storage; Dry box; Inovaxe; lead-free; Materials handling; MSD; SMT tours the assembly capabilities of pick-and-place and chip shooter manufacturers, including mixed assembly placement, thru-hole, placing miniaturized passives, and PCB and component handling. Tooling also is featured.
Surface Mount Technology White Papers

Featured White Papers

Sustainability Commitment A Key Driver for Product Development
There's a lot of talk about sustainability these days. While some firms have truly embraced a plan to drive toward more environmentally responsible products and ...
Sponsored By:  Henkel Corporation
Using Hansen Space to Optimize Solvent Based Cleaning Processes
What is an optimized cleaning process? Is it based solely upon removing the residue, or is it more? Of course it is more. We do not want to remove the labels or ...
Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
by Brian Toleno, Ph.D., Henkel CorporationIf you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed ...
Sponsored By:  Henkel Corporation

Recent White Papers

Tightening Up Type 4
Though the majority of assemblers are using Type 3 solder paste for most of today’s mainstream applications, the prevalence of finer-pitched devices is growing. ...
Sponsored By:  Henkel Corporation
Surface Mount Technology Events
Advertisement