Vinay Goel, vp of technology for Entegris, explains the challenges of measuring the performance of liquid filters, various tests that are used, and a new test based on fluoresence developed by Entegris. ; Entegris; filters; liquid particle filtration; Craig Hunter, VP and GM of Intermolecular's solar business unit, describes the company's recent successful effort to find solutions for optimizing surface morphology in solar cells.; hunter; Intermolecular; Intersolar; morphology; photovoltaics; PVWorld; SEMICON West; solar cell; Surface; video; Jitze Stienstra, director of gas microcontamination at Entegris, discusses the challenges of managing contaminants in leading-edge lithographic processes -- which in EUV could come from process materials, wafers, reticles, resists, and even tools.; Hamid Zarringhalam, EVP, technology, sales and marketing, Nikon Precision, talks about the need to extend double-patterning immersion lithography to 22nm, and describes solutions to meet overlay accuracy requirements and target throughput of 200wph.; double patterning; immersion; Lithography; Nikon Precision; overlay accuracy; SEMICON West; video; Zarringhalam; Jim Ohlsen, director of materials characterization at Entegris, discusses methods to improve yield at 32nm by controlling molecular contaminants in microenvironments, and describes the multiple solutions that will be needed at 22nm.; Robert Rhoades, CTO, Entrepix, describes the nontraditional technology behind TFT-dual gate memory and how CMP enables that innovation among others (e.g., TSVs, 3D packaging, MEMS, and engineered substrates).; 3d; CMP; Entrepix; memory; MEMS; packaging; Rhoades; SEMICON West; TSV; video; Steven Dwyer, VP & GM, North America, at EV Group, highlights of 3D integration papers the company presented at SEMICON West: achieving alignment accuracy down to 200nm, thin wafer handling at thicknesses <10μm, and 300mm-capable wafer bonding.; 300mm; 3d; dwyer; EV Group; SEMICON West; video; wafer bonding; Larry Smith, sr. member of the technical staff in SEMATECH's 3D interconnect division, discusses toolset acquisitions at the U. of Albany's CNSE, where work focuses on replacing traditional global interconnect and intermediate level processes.; 3d; Albany; CNSE; interconnect; SEMATECH; SEMICON West; smith; toolset; Entegris principal scientist Chuck Extrand discusses the impact constituents such as oxygen and water have on microenvironments at advanced nodes, challenges with respect to purging, and the multipronged approach needed for microenvironments at 22nm.; John Antone, VP, Energy and Environmental Solutions at Applied Materials, distinguishes between peak parity and grid parity, and why he believes there's room for c-Si and thin-film technologies in utility-scale large field applications.; a-Si; antone; Applied Materials; c-Si; grid parity; Intersolar; PVWorld; SEMICON West; solar; thin-film; Bart Swinnen, director of interconnect and packaging in IMEC's process technology unit, discusses the status of 3D technology efforts -- in particular, IMEC's work on TSV tech that will enable higher aspect ratio TSVs suitable for thicker dies.; 3d; IMEC; interconnect; SEMICON West; through-silicon via; TSV; video; Franklin Kalk, CTO at Toppan Photomasks, lists the lithography options for 22nm-16nm and below (immersion/double patterning, EUV, imprint) and why no option should be closed until a cost-effective solution is available with which everyone can live.; 16nm; 22nm; double patterning; EUV; immersion; imprint; Kalk; Lithography; SEMICON West; Toppan; video; Jeff Welser, head of the SRC's Nanotechnology Research Initiative, talks about the semiconductor industry's need for a new switch to replace the transistor, possible options, and recent funding. ; graphene; nanotechnology; NRI; SEMICON West; SRC; transistor; Jeff Hilbert, president and CEO of WiSpry talks about his company's approach to RF-MEMS with tunable capacitors.; Hilbert; MEMS; RF-MEMS; tunable capacitors; WiSpry; Jean Christophe (J.C.) Eloy, president and CEO of Yole Development, talks about the MEMS market and notable trends. ; Eloy; MEMS; MEMS market; SEMICON West; Yole; Eric Eisenhut, vp of sales and marketing for Kionix, talks about his company's MEMS microsystems including accelerometers, gyroscopes and microfluidics.; Eisenhut; Kionix; MEMS; SEMICON West; Jeff Spiegelman, founder and president of RASIRC, talks about the applications for high purity steam generation in IC and photovoltaics. ; Lithography; photovoltaics; rasirc; SEMICON West; spiegelman; steam; Hans Stork, group VP & CTO at Applied Materials, discusses the progress being made in developing cost-effective 3D/TSV solutions. The company is working in an open architecture environment to ensure complete solutions are ready for end users.; 3d; Applied Materials; SEMICON West; semiconductor; Stork; through-silicon via; TSV; Emmanuel Van Kerschaver, Group Leader, Solar Cell Technology Group at IMEC, highlights recent developments at the research center, including an 18.5%-efficient solar cell with copper-plated contacts, and a chloride-free solar cell texturing process.; IMEC; Kerschaver; photovoltaics; SEMICON West; solar cell; texturing; At SEMICON West, Horacio Mendez, executive director of the SOI Industry Consortium, previewed a major study that compares the manufacturability, performance, and cost of 3D transistors vs. bulk.; 3d; Mendez; SEMICON West; silicon; soi; Matthias Meier, manufacturing engineering & automation at the Fraunhofer Institute, discusses his role as "coach" of the PV Equipment Standards task force.; Fraunhofer; Intersolar; Meier; photovoltaic equipment; PV; SEMICON West; solar; standards; video; SEMI's newly appointed chairman, J.C. Kim of Edwards Korea, talks about the need to revisit the value proposition for SEMICON trade shows, the changing mix of members, and the need to emphasize green initiatives.; edwards; green; Korea; SEMICON West; show; video; Wally Rhines, chairman and CEO of Mentor Graphics, summarizes the key themes from his keynote at SEMICON West: no consolidation, the 65nm-45nm ramps are nothing new, and the industry recovery will beat that of the general economy.; design; Mentor Graphic; Rhines; SEMICON West; semiconductor; IMEC?s Ludo Deferm provides a look behind some major announcements the consortium made at SEMICON West: laser anneal over spike anneal, EUV mask cleaning, RuTa metallization showing promise for 22nm PVD.; 22nm; anneal; deferm; EUV; IMEC; Lithography; pvd; SEMICON West; Silicon Genesis president & CEO Francois Henley showcases the company's 20�m kerf-free foil, which is particularly well-suited to BiPV applications and capable of being made into solar cells with 20% efficiency.; BIPV; Henley; kerf; photovoltaic; SEMICON West; SiGen; Silicon Genesis; solar; wafer; The main theme at this year's NCCAVS Junction Technology Group meeting will be 22nm junction, which many believe this will be the first node to use msec-only annealing (i.e. diffusionless), according to meeting chair John O. Borland.; 16nm; 22nm; 32nm; anneal; Borland; diffusion; Junction; millisecond; SEMICON West; Ric Borges of Synopsys discusses the application of TCAD simulation to multijunction and CPV solar cells.; borges; photovoltaics; PV; SEMICON West; solar; Synopsys; Jeff Hebb of Ultratech discusses extending laser spike annealing to the 22nm node, previewing a talk at the NCCAVS Junction Technology Group meeting held Thursday, July 16 in San Francisco.; anneal; Junction; SEMICON West; Ultratech; video; Paul Siblerud of Semitool discusses 3D integration challenges and announces the latest news from the EMC-3D Consortium.; 3d; packaging; SEMICON West; Semitool; Sibelrud; Jan Vardaman discusses alternatives to 3D/TSV technologies for cost-sensitive applications, and makes the case for additional work to develop design guidelines and software, and test methodologies for 3D/TSV technologies.; 3d; SEMICON West; Techsearch; through-silicon via; TSV; Vardaman; Soitec's president and CEO, Andr�-Jacques Auberton-Herv�, discusses the three pillars of 3D integration at the wafer level, as well as bonding at room temperature.; 3d; SEMICON West; Soitec; wafer bonding; On a cost/Watt basis, thin-film solar PV is potentially very attractive, notes Linx Consulting's Mark Thirsk. If the technical challenges are solved, he's bullish that thin-film may take over a 30% share of the market.; SEMATECH's Bryan Rice gives a positive assessment of EUV and offers hope for getting companies to open their checkbooks for mask inspection infrastructure funding.; Bill McClean, president of IC Insights, talks about the rebound of the semiconductor industry in 2009, and his expectations of double digit growth in 2010 and 2011.; B.J. Han, chief technology officer of STATS ChipPAC talks about trends in advanced packaging technology. ; Confab; HAN; packaging; STATS ChipPAC;
