More Wafer Level Packaging Articles

Lasers package ultrathin semiconductors at low cost, high volume

Oct 26, 2011 North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microe...

Imec wafer-level MEMS packaging relies on nanoporous alumina membrane

Oct 21, 2011

Imec engineers have simplified the thin-film wafer-level MEMS packaging process with nanopores that prevent leaks into the package and a low-temperature processing approach.

ADI unveils digital isolator package to meet 8mm creepage reqs

Oct 5, 2011 Analog Devices Inc. (ADI) introduced a packaging technology for digital isolators that achieves a minimum of 8mm creepage distance required by global industry standards to ensure safe operation in ...

Invensas demos DFD implementation of its xFD technology

Sep 26, 2011 Invensas president Simon McElrea explains the company's new wire bond-based multi-die face-down (xFD) packaging technology, demo'd at this year's Intel Developer Forum, and its advantages in terms ...

Wafer packaging database provides WLP data

Sep 23, 2011

Research and Markets released "Wafer Packaging Fab Database," providing a global overview over 150 companies' 250+ mid-end semiconductor packaging houses.

Advanced semiconductor package test emphasized at new BiTS Workshop

Sep 16, 2011

The Burn-in & Test Socket Workshop (BiTS Workshop) is changing its name to The Burn-in & Test Strategies Workshop to reflect the "evolution of packaged ICs."

Wafer-level packaging emerges for uncooled IR imagers

Sep 9, 2011 Yole Développement highlights the movement of infrared (IR) uncooled cameras from defense to commercial applications. Microbolometers remain the dominant uncooled IR detector technology, with an em...

3M, IBM to make 3D chip adhesives

Sep 7, 2011 Forget "3D stacking" -- the two companies say a special electronic "glue" applied to the wafer will help stack dozens of chips into a "silicon skyscraper" that will be...

Sony licenses Ziptronix oxide wafer bonding patents

Aug 31, 2011 Ziptronix Inc. has licensed use of its oxide bonding technology for backside illumination imaging sensors patents to Sony Corporation. ZiBond technology enables more die per wafer, improving costs ...

Compugraphics expanding photomask sizes for WLP

Aug 19, 2011 Compugraphics International is widening its line of photomasks to include larger-area products up to 16 in2, responding to customer demand for wafer-level packaging and other semiconductor and opti...

Nemotek wafer-level camera integrates CMOS image sensors

Aug 17, 2011

Nemotek Technologie uncrated the Exiguus, with a VGA wafer-level camera integrating wafer-level optics assembled with CMOS image sensors (CIS).

Amkor expands package design kit for Agilent ADS

Aug 9, 2011 Amkor has extended its Quad Flat No-Lead (QFN) package design kit to be the first such kit available for Agilent Technologies' Advanced Design System (ADS) electronic design automation software.

LED, WLP, SiGe metrology challenges of today

Aug 4, 2011

LEDs, SiGe semiconductors, and WLP bumps each present their own challenges to metrology systems, says Alon Kapel, Jordan Valley Semiconductor.

SEMICON West: Roaming the floor, LEDs, CMP pads, kudos to Napoleon

Jul 14, 2011

Exotic pads for CMPs, flow meters with a nod to Napoleon, and driving down LED costs were among themes pursued by Techcet's Michael A. Fury on a walk through the SEMICON West show floor.

The search for a "super QFN" package

Jul 12, 2011

Arthur L. Chait, EoPlex, Inc., Redwood City, CA USA

One year later: Amkor/TI high-density copper pillar bump technology

Jul 11, 2011 In late June 2010, Amkor and TI announced that they had qualified and begun production of the industry's first fine pitch copper pillar flip chip packages—shrinking bump pitch up to 300% compared t...

TSV moves to "real engineering," but reliability data needed

Jul 11, 2011 Jan Vardaman, president and founder of TechSearch International, summarizes highlights from her SEMICON West presentation on TSVs, speaking to RDL development, LED packaging, and TSV-alternative Po...

Microsemi packages military DDR3 SDRAM in PBGA

Jun 28, 2011

The compact package suits mission-critical applications requiring up to 4GByte memory densities in smaller, faster packages with extended-temperature ranges.

Advanced packaging programs at SEMICON West emphasize holistic approach

Jun 24, 2011 SEMICON West preview: This year's SEMICON West Advanced Packaging Program is taking a broad approach, encouraging participation from across the supply chain to help keep pace with a rapidly expandi...

Flip chip probe card from Wentworth Laboratories withstands high-power, high-density test

Jun 21, 2011 The AccumaxDirect premier vertical probe card from Wentworth Laboratories withstands "severe test parameters" in high-volume flip chip/C4 test. It was just approved for use with Verigy te...

STATS ChipPAC widens fan-out WLP configurations with TSVs, IPDs

May 31, 2011 STATS ChipPAC says integrating through-silicon vias with passive devices and its eWLB technology addresses complex design issues, shrinking lithography nodes, and increased performance demands for ...

Agilent debuts benchtop SMU line to compete with expensive semiconductor analyzers

May 24, 2011 Agilent Technologies Inc. (NYSE:A) released the B2900A Series line of compact benchtop source/measure units (SMU) for semiconductor, component, and materials testing. The company claims that these ...

AMKR senior notes offering draws $400M

May 23, 2011 Amkor Technology (NASDAQ:AMKR) completed its offering of $400 million aggregate principal amount of its 6.625% Senior Notes due 2021. The proceeds from the offering will be used to fund the company...

Ramtron taps KYEC for SATS on its F-RAM

May 18, 2011

Ramtron (NASDAQ: RMTR) named Taiwan-based King Yuan Electronics Co., LTD (KYEC) to provide semiconductor assembly and test services (SATS) for its entire line of F-RAM products.

Benchmark "mid-end" tools and materials for 3DIC and wafer-level packaging (WLP)

May 13, 2011 Yole Développement released "Equipment & Materials for 3DIC and Wafer-Level-Packaging," a database and complete report analyzing in detail the equipment and materials tool-box ...

CSCD WLCSP HVM test probe card retains pin, scales from x1 to x8

May 6, 2011 Cascade Microtech (CSCD) launched a WLCSP probe card series that retains pin position, scales from x1 to x8 on a per-die basis, and can be configured for individual die testing. The Viper series wi...

RDL: an integral part of today's advanced packaging technologies

May 1, 2011 RDL technology has been instrumental in the development of many advanced packaging technologies such as fan-in and fan-out WLP, and TSV applications. Philip Garrou, MCNC, Research Triangle Park, NC...

IC packaging report covers 12 package types + bare die, SATS providers

Apr 28, 2011 New Venture Research will release "The Worldwide IC Packaging Market, 2011 Edition" in May 2011. It provides analysis of packaging by I/O count and package type, bare die interconnect, an...

Asian semiconductor packaging specialist orders SPTS etch, PVD and CVD technologies for TSV

Apr 26, 2011 SPP Process Technology Systems (SPTS) won a multi-system order for its Sigma PVD, Omega Etch and Delta CVD wafer processing systems from a leading outsourced semiconductor assembly and test (OSAT) ...

Electronics packaging leaders gathered under cherry blossoms at ICEP

Apr 21, 2011 T.Onishi, Grand Joint Tech and E.J. Vardaman, TechSearch International share the highlights on low-k dielectrics, 3D packaging, copper pillar, and other exciting work presented at the International...

Copper pillars appear in packages from Amkor to Unisem, says Vardaman

Apr 14, 2011 Following Intel's lead, many companies are moving to adopt copper pillar as the technology for their flip chip applications, as well as leadframe packages. E. Jan Vardaman, president of TechSe...

Beyond ball shear test Microprobing chip/package stress at Stanford

Apr 13, 2011 New work from Stanford goes beyond simple bump shear testing to allow simulation of stresses exerted on chips during semiconductor packaging. The researchers are able to explore how the stresses af...

Flip chip still in growth phase, even at $16B

Apr 11, 2011 Yole reports on the flip chip market, and finds that this $16 billion industry, with diverse applications, is still growing. New flip chip technologies, such as copper pillars, and technology deman...

Thermal analysis system tracks temp, air velocity and pressure from multiple points

Apr 8, 2011 Advanced Thermal Solutions, ATS, has released the iQ-200 thermal analysis system for precisely and simultaneously measuring the temperatures of solid materials and the surrounding air, as well as t...

Keithley 2652A SourceMeter tests high power semiconductors

Apr 6, 2011 Keithley Instruments Inc., advanced electrical test instruments and systems provider, introduced the Model 2651A High Power System SourceMeter instrument to characterize high-power electronics, lik...

Packaging Roadmaps at MEPTEC

Apr 1, 2011 Phil Garrou, Contributing Editor

SATS provider Sigurd chooses Multitest MT2168

Mar 31, 2011 Sigurd Microelectronics Corporation (Sigurd) will be the first adopter of Multitest's MT2168 pick-and-place test handler in volume production in Taiwan. The SATS provider will use it to test variou...

NXP claims smallest logic package

Mar 29, 2011 NXP Semiconductors N.V. (NASDAQ: NXPI) says that it has developed the smallest logic leadless plastic packages measuring 0.9 x 1.0 x 0.35mm with 0.3mm pitch. The packages also demonstrate 4x better...

Fujitsu resumes back end operations after Japan earthquake

Mar 25, 2011

About a fortnight since the 8.9 earthquake struck Japan near Sendai, Fujitsu has resumed some operations at its back-end packaging and semiconductor testing sites.

Si2 Microsystems will test fire samples for THT

Mar 22, 2011 Torrey Hills Technologies (THT) signed an agreement with Si2 Microsystems Pvt Ltd., India-based microelectronics company and THT furnace customer, for the use of its furnace to test-fire samples se...

IEEE surpasses 400000 members

Mar 18, 2011 IEEE reached the 400,000 member mark for the first time in its history. By the end of 2010, total IEEE membership had surpassed 400,000, making it the seventh consecutive year the association had e...

Unisem adds Accretech wafer prober for 12 in wafers in Sunnyvale

Mar 14, 2011 Accretech’s next generation prober, the UF3000EX, offers high-speed wafer handling, a low-noise XY stage, and high accuracy with its OTS (Optical Target Scope) positioning technology. 

Molex joins antenna consortium

Mar 14, 2011 Molex Incorporated, interconnect supplier, has joined with other researchers to advance the goals of the Danish SAFE (Smart Antenna Front End) project. Scheduled to span four years, the $8.7 millio...

Hermetic wafer level packaging lowers cost with IMT Au Au bond

Mar 8, 2011

IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.

NVIDIA licenses SMSC Inter Chip Connectivity technology

Mar 2, 2011

NVIDIA Corporation (NASDAQ: NVDA) has licensed Inter-Chip Connectivity (ICC) technology from SMSC (NASDAQ: SMSC), a leading semiconductor company creating valued connectivity ecosystems.

Gold tin process from Stellar Industries improves wettability in die bonding

Feb 28, 2011 The new gold/tin (AuSn) process from Stellar Industries is ideally matched to Stellar’s proprietary CPU copper on AlN submounts with its sharp guillotine edge for precise edge alignments.

Tessera terminates Amkor license

Feb 21, 2011 Tessera Technologies Inc. (NASDAQ:TSRA) announced that on February 17, 2011, it sent Amkor Technology, Inc. an official notice of termination of their license agreement with Tessera. The two compan...

STATS ChipPAC launches flip chip packaging for advanced silicon nodes

Feb 16, 2011 STATS ChipPAC launched fcCuBE technology, an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes. STAT...

Intel Capital leads InVisage Series C venture funding

Feb 15, 2011 InVisage Technologies, image sensor technology start-up, received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's quantum-dot...

Amkor record 2010 financials capital investments in 2011

Feb 10, 2011 Amkor Technology Inc. (NASDAQ: AMKR), semiconductor assembly and test services provider, announced financial results for 2010, with net sales of $2.94 billion, net income of $232 million, and earni...