Altera closed the gap on Xilinx considerably in 2010, but Xilinx's competitive 28nm product should enable it to stay at the top of the FPGA market. Start-up Achronix could be the first to reach 22nm because of its Intel connection. The Linley Group's FPGA report, "A Guide to FPGAs," covers competitors within the FPGA space, as well as FPGA adoption in the chip industry.
DelfMEMS and KFM Technology signed a common agreement to combine their expertise in RF micro-electro-mechanical systems (MEMS) and thin film packaging (TFP) technology. DelfMEMS will use the collaboration to provide packaged MEMS switches, fixed capacitors, and high-Q inductors on the same chip.
There are a few key attributes in new consumer electronics: a reduced footprint and/or profile, high electrical performance, fine-pitch design, custom features, and a low cost. Multi-row, wafer-level, flip-chip, and multi-chip packaging can meet these needs, say Unisem writers Rico San Antonio and Chris Stai. They compare the value of each packaging type.
Getting thinner appears to be the goal driving the market in both the wafer-level and substrate-level sectors, and innovative tooling and process technology will become paramount in addressing thinned packaging and ramping up to volume reliably, writes Dave Foggie from DEK.
Camtek Ltd. (Nasdaq:CAMT; TASE:CAMT) received an order for multiple wafer inspection systems from one of the world's largest manufacturers of CMOS image sensors (CIS).
InVisage Technologies, image sensor technology start-up, received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's quantum-dot-based QuantumFilm technology and products into mass production.
Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.
Amkor Technology Inc. (NASDAQ: AMKR), semiconductor assembly and test services provider, announced financial results for 2010, with net sales of $2.94 billion, net income of $232 million, and earnings per diluted share of $0.91. Amkor is currently planning capital additions of approximately $500 million for 2011.
SPP Process Technology Systems (SPTS) received a follow-on purchase order from CEA-Leti for its Sigma fxP PVD system. The 300mm system will be used for advanced TSV development at Leti's new 300mm fab extension in Grenoble.
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Sponsored By: Tessera Technologies, Inc.