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The Role of Wafer Bonding in 3D Integration and Packaging
There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), ...
Sponsored By:  Suss MicroTec
RoHS Means Big Changes for Power Devices. Are you Ready?
While design and assembly of today’s smaller, higher functioning semiconductor devices continues to be challenging, addressing the thermal requirements of ...
Sponsored By:  Henkel Corporation
New Die Attach Film Raises the Bar on Wetting and Molding Performance
Complexity, functionality, miniaturization and cost-efficiency have been and continue tobe the mantra of the electronics industry. Arguably, no segment is more keenly ...
Sponsored By:  Henkel Corporation
New Wafer Backside Coating Innovation Stacks Up Against Film
Consumers continue to drive demand for smaller, thinner and more capable electronicdevices which, then, require integrated packages that can cope with today’s ...
Sponsored By:  Henkel Corporation
µPILR™ Flip Chip for High-Performance Applications
The ever increasing market requirements for high-performance, high speed, and densely packaged devices with shrinking form factors have propelled the use of flip ...

Recent White Papers

Understanding Low Outgassing Adhesives
Applications that must meet stringent outgassing requirements now have more adhesive options than ever. If you suspect outgassing could potentially pose a problem ...
Sponsored By:  Master Bond, Inc.,
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