Süss MicroTec's Stojan Kanev tells SST/AP about the company's new addition to its toolset for 3D integration: a probe station targeting 300mm wafer-level 3D stacked structures.
Indium Corporation acquired the processes, equipment, and know-how of Reactive NanoTechnologies Inc. (RNT), developer and manufacturer of NanoFoil. NanoFoil delivers precise, instantaneous heat energy for advanced joining applications. RNT developed the NanoBond joining process to simplify manufacturing and ensure the benefits of NanoFoil are maximized.
Kwan-yu Lai, Micralyne, and Jeffrey G. Stark, Sensor Products, describe the use of color-coded pressure-indicating film to ensure uniform, correct pressure during wafer bonding. Wafers are bonded by applying precise combinations of physical pressure, temperature, and/or voltage. Pressure is measured as an average, assuming perfectly flat pressure plates.
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