Aries Electronics, manufacturer of interconnection products, now offers a CSP test socket with a window that optically exposes 100% of the top of the device under test (DUT) for failure analysis (FA) testing for emission microscopy (EMMI) or optical sensor applications.
The Multitest next-generation MT9928 bowl feed module, which passed the strict QA and production approval requirements of an international IDM, is a gravity feed handler with a variety of loading and unloading options. With a throughput of up to 14,500 uph, the bowl feed loading module is the loading option of choice for small package sizes during semiconductor test.
Through the Component Test organization of Sypris Test & Measurement, Maxtek now provides component testing, including electrical and package integrity testing, COTS up-screening, qualification, and characterization. These complement Maxtek's full-custom ASIC design, package development, assembly, and test services.
The Burn-in & Test Socket (BiTS) Workshop will take place March 7–10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ. More than 30 papers and posters will be presented; participants include end users and suppliers of sockets, boards, burn-in systems, handlers, and packages; and other related equipment, materials, and services. The TechTalk session on PCB design, fabrication and assembly is booked full, as is the tutorial on RF socket characterization by Gert Hohenwarter, Ph.D. of Gatewave Northern Inc. Here are some of the show highlights.
Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.
Taiwanese subcon ASE has ordered "multiple" tools for backend inspection from Rudolph Technologies, illustrating a trend to incorporate real-time process control into advanced backend fabrication processes.