Samsung Electronics says it has developed a new heat dissipating packaging technology for display drivers ICs in high-end TVs.
Honeywell (NYSE: HON) Electronic Materials debuted a printable thermal management material designed to help manage the high heat produced by increasingly powerful semiconductors in portable computing devices such as laptops and netbooks.
Ian Clark from Mentor Graphics explains how the company's new FloTherm Web-based software helps reduce the time spent on thermal characterization and design, illustrated by examples for both moving air and ambient thermal resistance.
This case study, a partner piece to Robin Bornoff/Mentor Graphics' discussion of fluid dynamics analysis for IC package design, examines how IDT used CFD thermal analysis in a packaging decision for a recent product launch.
On behalf of the World Gold Council (WGC), SEMI conducted a survey titled “Semiconductor Industry Opinions Concerning the Selection of Bonding Wire Material.” The survey was intended to gauge the semiconductor industry’s use of copper bonding wire versus gold for packaging applications. The WGC is a commercially driven organization focused on creating demand for gold. While 41% of semiconductor companies surveyed use copper bonding wire, none use it in the majority of their products. However, the majority of respondents will consider copper bonding wire in their new products.
The IMAPS-UK MicroTech-2010 and IEEE-CPMT Advanced Packaging Materials (APM), Feb. 28 to March 2 at Cambridge University, will be the major Spring 2010 event on electronics packaging, interconnection and integration conference in Europe.
Debbie Forray and Ilya Furman, Henkel Corp., compare a self-filleting die attach paste to film-based adhesives. Semiconductor companies are seeking lower-cost die attach material solutions to replace the higher-cost, film-based adhesive materials used for certain applications. One such material is self-filleting die attach paste.
Extending its capabilities for placing solder spheres at high speed, DEK's DirEKt Ball Placement process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm.