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EDITOR'S PICKS

First quarter semiconductor sales up 6% compared to last year
Sensor competition, actuator recovery impact supplier ranking
Applied Materials and Tokyo Electron terminate merger
How emerging IoT impacts the semiconductor sector
Global semiconductor sales increase in February compared to last year
U.S.-headquartered companies capture bulk of IDM, fabless IC sales
2014 top MEMS players ranking: Rising of the first MEMS titan

TOP BLOG POSTS

Moore's Law has stopped at 28nm
World record solar cell with 44.7% efficiency
Is the Chip Industry as Important as We Think? Depends on Whom You Ask
Are we using Moore's name in vain?
Applied Materials and Tokyo Electron unveil new company name
Trends in Packaging
Soraa founder wins Nobel Prize in physics

LIVE NEWS FEED

RECENT ARTICLES

ASE and TDK announce plans for joint venture agreement
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SEMICONDUCTORS ARTICLES

ASE and TDK announce plans for joint venture agreement
Channeling valleytronics in graphene
New approaches to small problems
Visualizing formation in BEOL

PACKAGING ARTICLES

ASE and TDK announce plans for joint venture agreement
Microchip Technology to acquire Micrel
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MEMS ARTICLES

MEMS industry influencers to present at SEMI European MEMS Summit
New approaches to small problems
ITRS 2.0: Heterogeneous integration
New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead

LEDS ARTICLES

New approaches to small problems
Quantum dots are finally ready for prime time
Defects in atomically thin semiconductor emit single photons
New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead

DISPLAYS ARTICLES

New approaches to small problems
Quantum dots are finally ready for prime time
Improving organic transistors that drive flexible and conformable electronics
New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...