Thin-film passives consortium wants participants - Advanced Packaging
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Thin-film passives consortium wants participants

March 4, 2011 - A new global R&D consortium on  is seeking companies to join its efforts working on embedding thin-film passive components into packages using through-silicon vias (TSV), for use in smart mobile electronics and implantable bio-electronic systems.

The Global Industry R&D Consortium in Thin Film Passive Components (TPC), housed at the Georgia Tech Packaging Research Center (PRC), will focus on micro/nanoscale high-density, low-loss capacitors and inductors as surface thin film passives on silicon or glass, and digital and RF passives as thin-film integrated passive devices (IPD) with high permittivity and permeability dielectrics and noise isolation structures. These then can be added into the package, realizing system miniaturization with improved performance.

Areas of research include:

- High-density inductors: High permeability and low-loss magnetic core for higher volumetric and power efficiency

- High-density capacitors: Advanced high-surface area electrodes and conformal dielectrics

- Package integration of supercapacitors and thin film batteries

- TSV and trench capacitors: Advanced dielectrics with low-cost wafer-compatible processes.

- RF components: Stable dielectrics with high permittivity and permeability

- EMI isolation: Horizontal and vertical EMI isolation in 3D systems.

And the consortium's listed goals:

- Power supply components with 10-100X enhancement in component volumetric efficiency;

- Enhanced film properties for lower loss and improved efficiency;

- Power integrity in high-speed processors and 3D ICs;

- Integrated energy storage in packages;

- Stable dielectrics with high permittivity and permeability at high frequencies;

- Tunable thin-film components;

- Noise isolation in mixed-signal systems

The PRC's previous work led to high-density capacitors on silicon and organic packages to demonstrate power noise suppression in high-speed digital systems, and novel magnetic composites for high-density inductors. It also has led work developing and integrating high-Q RF components on silicon and organic packages, novel high permittivity and high permeability materials for miniaturizing RF components as well as unique EMI isolation structures.

More info about the TPC consortia, including contacts for companies interested in joining, are at