February 16, 2011 -- DuPont Microcircuit Materials (MCM) introduced DuPont Solamet PV701 photovoltaic metallization paste as its newest generation of metal wrap through (MWT) technology for backside interconnected silicon solar cell designs. It enables the manufacture of back-contact cell designs delivering up to 0.4% greater conversion efficiency for solar cells..
DuPont Solamet PV701 photovoltaic metallization paste is developed as an enabler to provide up to 0.4% greater efficiency in MWT cell designs versus standard cell designs. MWT is a specialized cell structure that transfers the bus bars on the front side to the backside, reducing shading on the front side of the cell. The connections are made through holes in the silicon with the same composition as the bus bars. Employed as a via paste and p-contact metallization for backside tabbing interconnects, Solamet PV701 features excellent electrical contact to frontside silver grid structures, high-mechanical strength, low shunting, high-line conductivity and outstanding solderability as a p-contact metallization.
DuPont Microcircuit Materials provides specialized thick film compositions for a wide variety of electronic applications in the photovoltaic, display, automotive, biomedical, industrial, military and telecommunications markets. DuPont (www.dupont.com) is a science-based products and services company. For more information on DuPont Microcircuit Materials, visit http://mcm.dupont.com or http://photovoltaics.dupont.com.