Trends in Wafer Bonding for MEMS and 3D Integration

Trends in Wafer Bonding for MEMS and 3D Integration

Sep 18, 2008
Jean-Christophe ELOY, President and CEO, Yole Développement
Dr. Nicolas Sillon, Group Manager Packaging and Integration, CEA-Leti Minatec
Paul Lindner, Executive Technology Director, EV Group (EVG)




Trends in Wafer Bonding for MEMS and 3D Integration
The wafer-level capping of fragile MEMS structures (e.g. for accelerometer, gyroscopes and pressure sensors) for protection and sealing purposes with wafer bonding is quickly displacing chip-scale packages. Especially for novel consumer MEMS applications (see the Apple iPhone or the Nintendo Wii) that have to keep record-small form factors, wafer bonding is a major contributor to reduce the manufacturing costs of the final package. New bonding schemes for "true" wafer-level-packages (protection, interconnection and testing at the wafer level) are being discussed with regards to market potential and equipment requirements.

The successful technology transfer of wafer bonding and related advanced manufacturing technologies from MEMS packaging into 3D wafer stacking of CMOS based applications (e.g. CIS packaging, DRAM stacking) will be another major topic of this webcast.




Jean-Christophe ELOY
President and CEO
Yole Développement


 

Dr. Nicolas Sillon
Group Manager Packaging and Integration
CEA-Leti Minatec


 

Paul Lindner
Executive Technology Director
EV Group (EVG)