Gold/tin process from Stellar Industries improves wettability in die bonding - Advanced Packaging
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Gold/tin process from Stellar Industries improves wettability in die bonding


February 28, 2011 -- The new gold/tin (AuSn) process from Stellar Industries is ideally matched to Stellar’s proprietary CPU copper on aluminum nitride (AlN) submounts with its sharp guillotine edge for precise edge alignments.

The new gold/tin process improves wettability and offers variable freeze time options to ensure efficient laser die bonding. Reduced micro-voiding improves thermal performance for increased reliability.

The AuSn performance is available from 70Au/30Sn to 80Au/20Sn compositions.

Learn more about this product at (508) 865-1668; [email protected]

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