Productronica Show Preview: Materials - Surface Mount Technology
This article is from
| RssImageAltText

Productronica Show Preview: Materials


(October 27, 2009) MUNICH, Germany — The Munich Electronics Summit and productronica will take place November 10–13 in Munich. With 1,477 exhibitors from 35 countries in 2007, the tradeshow is designed to cover all aspects of traditional electronics manufacturing from PCB and other circuit-carrier manufacturing and soldering technology to cable-processing and component-mount technologies, measuring and testing technology, and quality assurance. For a preview of the soldering, testing, and other equipment at the show, read Productronica Show Preview: Equipment.

Fluid Dispensing


The 700 Series is manufactured and packaged silicone and chloride-free and designed to work with industry-standard equipment to ensure accuracy, repeatability and productivity. The series offers a traditional syringe barrel and matching components. The 700 Series syringe barrels have a near 0° internal wall taper for smooth, consistent piston travel. Natural color suits general applications; dark amber and black are available when requiring protection from UV and visible light. Three accompanying pistons, including the new Blue Easy-Flow, are available. Blue Easy-Flow Pistons have close tolerances and require less pressure to dispense fluids consistently and prevent air from becoming trapped during the dispensing process. Receiver head assemblies are preassembled. Techcon Systems and German partner Globaco, A4.127.

New Materials

Low-cost, RoHS-compliant Theta halogen-free circuit laminates offer low loss; electrical, mechanical, and thermal stability; and low-z-axis CTE for reliable plated-through-hole (PTH) connections in multilayer board constructions. The Theta materials also meet UL-94-V-0 level flammability requirements.
Rogers will also feature the company’s two new antenna-grade materials.  RO4730 laminates offer performance and processing with the ease of FR-4 materials, incorporating a proprietary filler for 30% lighter weight than glass-reinforced PTFE materials.  For designs requiring superior performance, RO3730 laminates achieve a lower dissipation factor than competitive PTFE materials (0.0013 at 2.5 GHz) while offering passive intermodulation (PIM) performance of typically less than -154 dBc.
RO4000 LoPro circuit laminates for high-speed digital and high-frequency analog applications combine a low-profile copper foil and low-loss dielectric material for low insertion loss, low PIM, and excellent signal integrity for electrically demanding applications. RO4360 laminates are a high Dk (6.15) material extension based on RO4350 laminates. Like RO4350B laminates, RO4360 laminates have thermal-mechanical performance combined with FR-4 process compatibility.
RT/duroid 5880LZ very low-density (1.37 gm/cm3) filled PTFE composite material, with extremely low dielectric constant (1.96), suit high-frequency performance requirements, and applications such as satellites and aerial vehicles. Rogers Corporation (NYSE:ROG), B2.401.

Lead-free Products

The SN100C lead-free solder paste, bar and wire will be highlights, along with consultations on SN100C adoption. Initially developed for use in wave and selective soldering applications, SN100C is also available as a Pb-free HASL finish, solder paste, solid and cored wire, ribbon, pre-forms and spheres. SN100C is the Sn/Cu/Ni+Ge alloy developed by Nihon Superior.  Inherent characteristics include high fluidity, low copper erosion, low drossing, superior wetting, and no shrinkage defects.
The UltraSlic FG solder paste stencil offers paste release below surface area ratios of 0.5. Using the latest stencil laser technology and Datum Alloys’ new Fine Grain stencil material, exclusively distributed by Ed Fagan Inc., UltraSlic FG stencils reportedly offer improved aperture registration, higher performance, and lower cost compared to electroform; the option of step stencils; and the option of same day turnaround times. FCT Solder, a division of FCT Assembly, A4.570.

Cleaners

AQUANOX A4241 PCB and stencil cleaner is an aqueous cleaning solution designed with an inhibition technology to be effective on tough soils while protecting sensitive parts from etch or darkening. It can be used in a multi-process environment for spray batch, spray in-line, and stencil cleaning processes. A4241 reportedly leaves shiny solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring. It is multi-metal safe including bare aluminum and copper. Nonflammable, noncorrosive, nonhazardous, and biodegradable, the cleaner is compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes.
CYBERSOLV141-R is designed for optimum effectiveness on soils typically found in electronics assembly and maintenance cleaning applications including flux, paste, inks, uncured adhesives, waxes, mill markings, greases, oils, fingerprints, etc. It is a replacement for HFC 141B precision cleaning applications, and is safe and effective to use for benchtop electronics cleaning. It is compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes. A biodegradable non-flammable non-corrosive aqueous solution, CYBERSOLV141-R contains no CFCs or HAPs. Kyzen Corp., A2.340.

productronica visitors can order their tickets, and redeem guest tickets and e-guest tickets, via online ticket registration. Registered visitors will receive information about exhibitors and presentations in the program of related events. To register, visit www.productronica.com/ticket.

For a preview of the soldering, testing, and other equipment at the show, read Productronica Show Preview: Equipment.



This article is from

SMArticle Categories:

Surface Mount Technology Test and Inspection
Assembly Business
Cleaning Wire News
Design SMT Magazine Current Issue
Printing SMT Archives
Soldering  

Advertisement