Nanometrics wafer-to-wafer bonding metrology tool launches with logic order - Advanced Packaging
This article is from

Nanometrics wafer-to-wafer bonding metrology tool launches with logic order

February 24, 2011 - Business Wire -- Nanometrics Incorporated (NASDAQ:NANO), advanced process control metrology system supplier, installed a next-gen UniFire 7900IR metrology system at a leading manufacturer of advanced logic devices. The Unifire 7900IR provides 3D inspection of wafer-scale packaging features as well as registration for wafer-to-wafer bonding applications for use in advanced wafer scale packaging process control.

"Careful control of lithography and etching in the through silicon via (TSV) flow, bumping, and wafer-to-wafer bonding processes is critical to enable high yielding devices for next generation advanced packaging. This latest system offers a new 3D inspection capability as well as an infrared (IR) microscope option, allowing direct measurement of features and structures in bonded wafer stacks," commented Dr. Michael Darwin, VP of the UniFire and Materials Characterization Groups at Nanometrics.

Existing UniFire systems can be field upgraded with both IR and 3D inspection options to further extend the capability of installed tools.

To learn more about the UniFire 7900IR and Nanometrics process control metrology solutions, visit Nanometrics at SPIE Advanced Lithography, San Jose Convention Center, March 1st-2nd.

Nanometrics provides advanced, high-performance process control metrology systems used primarily in the fabrication of semiconductors, high-brightness LEDs, data storage devices and solar photovoltaics. Nanometrics is traded on NASDAQ Global Select Market under the symbol NANO. Nanometrics' website is

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on by clicking Or join our Facebook group