MEPTEC Packaging Roadmaps attendee wants more collaboration and partnerships - Advanced Packaging
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MEPTEC Packaging Roadmaps attendee wants more collaboration and partnerships


(November 18, 2010) -- Advanced Packaging’s senior technical editor Debra Vogler asked Tarun Verma, senior director, packaging engineering at Altera, to comment on the MEPTEC Semiconductor Packaging Roadmaps conference (11/10/10, Santa Clara, CA).

Listen to Verma's recap: Download (iPhone/iPod) or Play Now

Verma calls collaboration and partnerships across the supply chain critical to tackling interconnect and packaging challenges, which are becoming a larger part of the semiconductor cost equation, and was pleased with the attention the conference presentations brought to the topic.

With respect to technical challenges, Verma observed that copper pillar platform technology, such as that introduced by TI this year, is an essential first step that can set in motion the kind of partnerships and collaboration that will be needed going forward. Additional topics he would like to see covered include standardization, heterogeneous integration, EDA tools, and the cost and business models that will be needed going forward.

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