March 2, 2011 - BUSINESS WIRE -- NVIDIA Corporation (NASDAQ: NVDA) has licensed Inter-Chip Connectivity (ICC) technology from SMSC (NASDAQ: SMSC), a leading semiconductor company creating valued connectivity ecosystems.
ICC enables the USB 2.0 protocol, which is now standard in billions of electronic devices, to be delivered over short distances consuming a fraction of the power of a traditional USB 2.0 analog interface while retaining 100% software compatibility with an analog USB 2.0 connection. The High Speed Interconnect (HSIC) specification (an addendum to the USB 2.0 specification) incorporates ICC technology. Where applicable, such as in portable applications, the ICC technology dramatically decreases power consumption and silicon area compared to an analog USB 2.0 interface.
Using its ICC license with SMSC, NVIDIA can develop devices that are designed to be compliant with the HSIC specification for both USB 2.0 host and USB 2.0 device applications.
SMSC's ICC technology is described in U.S. Patent No. 7,702,832, which was issued to SMSC on April 20, 2010. Additional related patent applications have been filed by SMSC in the United States and other countries. As provided for in the appropriate agreements, USB 2.0 promoters and companies that have timely signed both the USB 2.0 Adopters Agreement and a related HSIC amendment letter may license SMSC's ICC technology patents under reasonable and non-discriminatory (RAND) terms. Further, SMSC's ICC technology is now available to the industry at large through individually negotiated patent licenses from SMSC.
SMSC develops Smart Mixed-Signal Connectivity solutions. SMSC employs a unique systems level approach that incorporates a broad set of technologies and intellectual property to deliver differentiating products to its customers. The company is focused on delivering connectivity solutions that enable the proliferation of data in personal computers, automobiles, portable consumer devices and other applications. Additional information is available at www.smsc.com.