More productronica Exhibits - Surface Mount Technology
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More productronica Exhibits


productronica 2009 will take place November 10–13 in Munich, Germany. Following are more new and flagship products to see at the electronics manufacturing tradeshow, not featured in our Productronica Show Preview: Materials, Productronica Show Preview: Equipment, or productronica 2009: Product Showcase.

Solder Paste Inspection and AOI 

The SE500X advanced 100% 3D solder paste inspection (SPI) system is a larger board version in the SE500 series. Now able to accommodate boards/panels measuring 100 × 100 mm up to 810 × 610 mm, SE500X inspects with >80 cm2 /second speed. The SE500 and SE500X systems can inspect pad sizes down to 01005 component size (150 × 150 µm) at line speeds. The SE500 features a conveyor that can transport board/panels from 50 mm2 to 510 mm2. Standard features for both models include automatic conveyor width adjustment, mechanical board stop, 1D and 2D multiple barcode read using the sensor, and Process Tracker SPC charts with alarm capability in the user interface. Additionally, the SE500 has enhanced warp compensation for flexible circuits, the ability to handle odd-shaped pads, and an XML file format output for easy integration to shop floor control systems. The SE500 also can run program files originally created for the SE 300 Ultra.
Flex HR is an enhanced-resolution AOI system with inspection performance for 01005 components. As one of the highest-speed inspection systems in the industry, Flex HR suits assembly lines producing a wide range of products including memory modules, notebooks PCs, mobile phones, automotive products and other industrial electronic assemblies.
The FLEX HR inspection software now has auto-seeding capability for faster automatic model building by automatically selecting best examples from the supplied training set. Creating a robust model with the auto-seeding function is simple and fast during programming. CyberOptics Limited, A2.417.

Insertion System

The PLT-902 Dual Head Terminal Inserter System will be demonstrating the insertion of two Interplex press-fit terminals: a 0.64mm connector terminal and a 0.80mm dual press-fit stacking terminal. The terminals will be inserted using the new 902 SXT Insertion Head. UMG Technologies, Interplex booth, A4.526.

Suite of Profiling Products

OvenCHECKER is a no-thermocouples-required single-pallet, profiler-included, reflow oven verification tool. MEGAM.O.L.E. 20 is a twenty-channel thermal profiler. V-M.O.L.E. is a PCB profile verification tool. The suite is designed to establish recipe requirements, characterize and verify profiles, and ensure that the oven is continuing to operate in spec with the profile parameters. All products are designed to be engineering-sophisticated and operator-friendly. Features such as the OK Button on all three tools give a clear Go/No-Go signal, enabling decisions based on the engineer’s profiling-parameter input to be made at the operator level. Readiness indicators on the profilers eliminate any wasted runs that may occur if any of the profilers are too warm or there’s an open-thermocouple condition. Following the profile, the Target-10 function of the M.A.P. software facilitates honing in on the location of a failed profile. Over 185 customizable data extractions provide for analysis, and the ability to customize one-page reports for an EMS or OEM based on their specific needs. After the initial profile has been established and verified using the MEGAM.O.L.E. 20 and/or the V-M.O.L.E., the thermal management process can often break down. Using ECD’s M.A.P. software as it travels through the oven, the OvenCHECKER compares the oven’s profile to the engineer’s target-profile input, and with a single button push, the patent-pending OK Button indicates if the oven is in or out of specification. Able to store over 90 runs, the OvenCHECKER allows an operator to verify profiles all day without having to transfer data or find an engineer. The verification tool includes a long-life lithium rechargeable battery, charged via USB connection. ECD, co-exhibiting with XDry, A3.146.

Process Audit Tool for Dry Cabinets

M.O.L.E., based on the V-M.O.L.E. from ECD, is a process audit tool for ultra-low humidity desiccant dry cabinets. The XDry M.O.L.E. records and reports internal/external temperature and humidity inside a dry cabinet. It adapts an industry-standard temperature profiling system to include moisture measurements. Using ECD's data acquisition technology and M.O.L.E. MAP reporting software, it analyzes and reports on actual cabinet conditions. XDry, A3.146.

Halogen-free Lead-free Solder Paste

Indium8.9HF solder paste is a halogen-free, lead-free solder paste offering print transfer efficiency and response-to-pause printing. The advanced rheology suits advanced 0.4-mm-pitch and 0201 technologies. The solder alloy is halogen-free tested per EN14582 test method, with a proprietary activator package and oxidation barrier, which allows it to coalesce and wet without halogens. The oxidation barrier also ensures there is no graping on small passives. The oxidation barrier and high slump resistance allows Indium8.9HF to effectively eliminate head-in-pillow (HIP) defects. The solder can be manufactured with tin/lead (SnPb) powder so it can be used on products currently exempt from RoHS. In a SnPb process it offers high thermal stability and low voiding. It also eliminates the need to change solder paste chemistry when transitioning to a RoHS-compliant environment. Indium, A2.320.

Soldermasks, Pastes, and Inks

PSR-4000 CC200 HRS is a high-productivity solder mask designed for curtain coating. It has very fast exposure and excellent resistance to harsh final finishes such as immersion tin (ImSn).
PSR-4000 QD was formulated to give excellent coating and drying performance in spray applications. It suits coating equipments that use infrared (IR) tack drying. PSR-4000 QD also has fast photospeed and excellent resistance to harsh final finishes.
PSR-4000 LDI (US) is a screen-printable soldermask for laser direct imaging (LDI) applications. It has fast photospeed and is a dark green color. A curtain coatable version will be released soon.
PSR-4000 W8 super white soldermask for LED applications is formulated to have outstanding reflectance and to resist color change from the high heat and UV associated with LED lighting applications.
A line of specialty and custom conductive paste and ink products suitable for printed electronics and solar cell fabrication applications are now available with a wide range of material, electrical, and physical properties.
Also featured will be Taiyo’s line of legend and marking inks and via hole plugging inks including THP-100DX1 VF, which is designed for use in automated hole filling equipment from suppliers such as ITC and MASS. TAIYO AMERICA INC., a subsidiary of Taiyo Ink Mfg. Co. ltd., B2.527.

Halogen-free Solder Paste

SN100C P600 D4 solder paste is a halogen-free, high-reliability, no-clean, lead-free solder. Designed as a high-reliability solder paste for high-density assembly with stable printability, the paste provides excellent reflow with good wetting and minimum incidence of mid-chip balling, low residue and significant cost advantages. Additionally, it typically can be reflowed with a profile similar to that which is commonly used with SAC305 and SAC405 with 240°C peak. Nihon Superior Co. Ltd., A4.570.

Test Products and Services

The flying prober Condor III offers simplified maintenance and failure diagnosis, a new four-wire measurement = Kavin (4 wire) resistant measurement technique, and improved fiducial recognition. Two testers integrated into one hardware system provide increased flexibility and lower cost-of-ownership for application-specific test requirements. It integrates a MTS30 rack into a Flying Probe Condor III system. The portable MTS30 rack can be removed to be used separately as a stand-alone test system. According to the needs of current production schedules, the system can operate as flying prober or as desktop test system. Users can choose between the adapterless/fixtureless flying probe test, a bed-of-nails test using a fixture, or a combination thereof. The system has a 19″ footprint. Fault diagnosis and maintenance of the test rig is more simple and fast, as the new system has a status display to inform the user about the system’s condition. Four-wire measurement allows for measuring extremely low resistance values, independent of system-inherent contact resistances. Two separate test access points are required at both net nodes of the component-under-test for true four-wire measurement. By means of an additional second test wire per flying probe head, a simulated four-wire-measurement can be performed, even if the board-under-test doesn’t permit access on two points per node. This allows for compensation of system-inherent resistance offsets. Only the contact resistance between test nail and DUT remains uncompensated. It can be taken into account by an optional software offset parameter value. The recognition of fiducial marks has been greatly enhanced using an adaptable lighting intensity. Even the most critical images of fiducials can now be recognized.
The Reverse Engineering Service recovers board designs for repair and/or re-manufacture, using a tool called Digitizer. With the Digitizer, the board data is re-created and all the connectivity is discovered. A CAD file for the board can then be generated that has all the board components and nets and that can be used in repair and/or re-manufacture. Board schematics can also be supplied.
Digitaltest handles all board test needs as an outsource test partner. Services include applications, test program generation, debug and fixture build. Digitaltest can use any test programs and fixtures from all manufacturers such as GenRad, Teradyne, Agilent (HP) etc. Digitaltest GmbH, A1.365.

Complete Manufacturing Lines

Turnkey lines for small to large production include printers, dispensers, pick-and-place systems, reflow and curing ovens, handling modules, storage systems, and software for stock management and traceability.
Machines for the solar industry will include the SP900-S screen printer with 8 µm accuracy for solar cell metallization processes. Its vision system recognizes the edges of the cell as well as structures on the wafer so multiple layers can be printed on top of or precisely next to each other.
New printer models will be introduced. An automatic electronic squeegee pressure regulation is available as an option for the SP150 printer. The SP004 semiautomatic printer features excellent printing accuracy and extras such as vision system, laser pointer, and a synchronous screw drive for table lift.
Activities in Essemtec’s booth will be followed live on Twitter (www.twitter.com/essemtec).
In the service corner, customers and users can discuss questions and suggestions directly with the product and process specialists. Essemtec AG, A3.358.

Rework Systems

The MRS-1000 Modular Rework System is a powerful high accuracy bench-top system for processes requiring increased control such as the removal of delicate SMT components.
The MFR-1100 Multi-Function Rework System can deliver responsive and repeatable heating for a range of assembly tasks. The single output system uses both a soldering cartridge and tip.
The Metcal MX-5000 Soldering, Desoldering and Rework System is a high-performance package for complex assembly challenges, combining increased power with SmartHeat Technology to eliminate overshoot potential and maintain high productivity soldering and rework. Offering high throughput and precision control, the MX-5000 also incorporates a built-in digital power indication display for continuous operator feedback and consistent, quality solder joints. Highly flexible and easy-to-use, the Metcal system measurably reduces training investment.
The APR-5000 XL/XLS Array Package Rework System will also be on display. It now allows the use of inner and outer preheaters at the same time, reducing rework cycle time and protecting the component under rework by lowering nozzle temperature to achieve the same required temperature with solder joints or balls and reducing BGA lid temperatures. The APR-5000-XL/XLS will now have the ability to manage the narrow lead-free process window without reaching excessive peak temperatures that damage components, connectors, other solder joints and the PCB substrate. The simultaneous use of an inner and outer preheater at different temperatures delivers precise control and faster profiling. In most cases, the preheater nozzle and reflow top nozzle can be used at the same temperature in the final zones to achieve target temperatures. New software on the APR-5000 system simplifies rework for a faster, safer, and more repeatable performance. OK International, A4.127.

Chipshooters, Flexible Mounters, Intelligent Feeders, and Software

The KE-3020 high-speed flexible mounter will launch at the show. The FX-3 chipshooter is rated at 60,000 CPH and will be shown in a line with the KE-3020, demonstrating minimum footprint and maximum flexibility by placing parts from a 0402 chip to a 50 × 150 mm connector. The FX-3 is an ultra-high-speed assembly system.
The entry-level KE-2060 Light flexible mounter provides a cost-effective option with a quadruple head with laser alignment or one high-precision placement head with vision and laser alignment.  It has IPC-rated placement of 12,500 CPH laser alignment and 1,750 CPH vision centering. The mounter can place 0201s to components 75 mm2 to 50 × 150 mm and up to 12 mm in height.  The KE-2060 Light also offers a placement accuracy of ±30 µm (3 sigma) with vision centering and ±50 µm with laser alignment. Options include exchangeable feeder trolleys, high-precision camera for microBGAs and 0.3-mm-pitch area-array devices. 
The FX-1R high-speed chipshooter offers high throughput and precise component centering. It is equipped with a double head system driven by two independent linear motors. Both quadruple heads have a multi-nozzle alignment system using a high-resolution laser to simultaneously measures four different components in width, length and height. In-flight measurement eliminates idle time. The chip shooter features a placement rate of 27,000 CPH (IPC 9850), and a component range from 01005 to 20 mm2. The system’s placement accuracy is ±50µm (3 Sigma). While one head is placing components, the other simultaneously picks. The FX-3 and KE-3020 placement platforms at productronica will feature JUKI Electrical Tape feeders (ETF). The motor-driven electric feeder can feed sensitively for ultra small components, steadily and fast. There is no need to stop the machine when replenishing components using the splicing function.
The IFS-X2 RFID intelligent feeder system with traceability is a second-generation feeder system with enhanced graphics and an improved user interface that makes feeder set up easier, faster, and more accurate. IFS-X2 allows for inventory control and features a closed-loop system that tracks the entire material flow and production process to ensure error-free production and total traceability with RFID technology. IFS-X2 features a graphical set up wizard that leads the operator from retrieving a reel from stock through feeder loading. On- and off-line feeder banks are networked. Additionally, the system features a closed-loop system that checks for accurate feeder set up before production. IFS-X2 updates inventory when new and used reels of components are received. Component count is done in real time. The Web services interface allows real-time communication to all ERP systems. The system uses a 1D or 2D barcode scanner that identifies incoming boards for production. All components placed on that board are then recorded and stored in a database that allows for future tracking of the components and the generation of traceability reports.
The Intelligent Shop Floor Solutions (IS) is a complete software production support system comprising Intelli PE for creating production programs, Intelli PD for downloading production programs to multiple lines, Intelli PM for improvement of the operating rate of the entire floor, Intelli SCS (setup control system) for parts verification and traceability, and Intelli EM for management of feeder maintenance history. The system uses barcodes and 2D barcodes for quality control such as prevention of faulty mounting of components and traceability for streamlining of set up time. For authentication of tape feeders and tray supply devices, users can select from barcode RFID. The software allows users to monitor line operation status and production control information in the plant real-time from a remote location. Advanced features include standardized graphical operation screens across applications, and the ability to switch interface language to English, Japanese, or Chinese from any screens. JUKI, A3.143.

Modular Dry Cabinet 

Designed for IPC J-STS-033B.1 for handling of moisture sensitive devices (MSD), the MSD 1200 Series desiccant cabinets offer a modular enclosure with access from two sides that can be expanded to meet growing production, and a powerful dry unit with closed loop on-demand regeneration.
The U5001 Dynamic Series Zeolite dryers feature powerful dehumidification, enabling a basic MSD1212 to take 240 seconds to move from 50% RH to less than 5% under unloaded conditions at 25°C. Optimal humidity levels are below 0.5% RH.  These units are designed to regenerate only when necessary. If there are no door openings, the dry unit will not regenerate, consuming less power. If frequent access to the cabinet is required, the dry unit will automatically regenerate more often, with a high-efficiency regeneration process taking 10 minutes. The integrated cabinet and dry unit design targets quiet and maintenance-free operation. Average power consumption is 30W per hour, including a radial fan that delivers gentle circulation. Totech Super DryR, A3-234.

Depaneling, Odd-form and Mechanical Assembly, Etc.

The 1300 SR stand-alone router minimizes depaneling stresses and provide superior edge finish. This new stand-alone router has a modular concept that allows multiple configurations to match unique process requirements. Single table or rotary indexing configurations are available.
The 800 OF for odd-form assembly is a flexible pick-and-place system that can be used for odd-form component assembly, through-hole and SMD. The 800 OF is a smaller, lower cost system compared to the 1000 OF, suiting applications with fewer components.
Laser workstations can be used for marking FR4 and a range of other materials, welding plastics and metals, cutting various materials, and other customized applications. Laser systems provide speed and flexibility compared to other traditional processes. They are available in bench-top, stand-alone, and in-line platforms.
Also on show will be Cencorp’s 1000 BR bottom router, 1000 OF odd-form assembly cell, CTC 800 low cost assembly cell, and the DTH tray handler. Cencorp, A3.347.

Offset Placement after Solder Screen Printing

JUKI’s solution for offsetting placement after solder screen printing, addresses the problem of solder paste alignment errors.  With this technology, the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand.  While board makers strive to keep variations between lots to an absolute minimum, it is not possible for them to eliminate forward expansion and scaling completely. This means that the pads are not exactly in the same positions as they were on the previous lot. When the boards are fed into the stencil printer for solder paste there can be slight offsets from the solder paste print to the pad location. In larger parts that can be a very small percentage of the pad size, but in smaller parts like 01005, 0201 or even 0402, the solder could be halfway off of the pad. Likewise with ceramic or flexible boards, print repeatability can be difficult to achieve, causing further solder paste alignment problems. There also is cause for concern on double-sided boards because boards tend to contract after the first side reflow process. With the increased use of lead-free solder, the properties of the self-alignment effects have changed. Through extensive research and cooperation with high-volume manufacturers, Juki has found that placing small components centered on the paste and not the pad will reduce the defect rate. The Offset Placement After Solder Screen Printing system addresses this issue. When the system is integrated into the electronics assembly machine, it eliminates the need for other equipment such as AOI machines to correct for solder paste alignment problems and provides a comprehensive solution to meet the future market trends of component miniaturization, high-density placement and lead-free assembly.

In-House Event

Siemens Electronics Assembly Systems GmbH & Co. KG will welcome interested visitors to a special in-house event at its headquarters location. The SIPLACE team will focus especially on the exchange of information with experts from the electronics manufacturing industry. In workshops and presentations, visitors can exchange information and talk about the opportunities provided by modern build-to-order manufacturing concepts. Well-known electronics manufacturers like ebm-papst, Gigaset, Pepperl & Fuchs and Epcos will give practice-oriented presentations about their manufacturing process improvements and their respective results. In the technology exhibition, visitors will be able to take a close look at live demonstrations of placement solutions from the SIPLACE D-Series and X-Series as well as the SIPLACE SX with interchangeable gantries, the SIPLACE MultiStar head, and the latest software developments such as SIPLACE Facts and SIPLACE LES. During guided tours of the new SIPLACE factory, visitors can see how the SIPLACE placement solutions are manufactured in accordance with lean production principles. The SIPLACE in-house event will be open for all industry visitors on Productronica show days from 9:00 AM until 5:00 PM. Transfer to the SIPLACE facility from the Trade Fair Centre is via a shuttle bus service. To request a detailed program and receive an invitation, log on to www.siplace.com/productronica.

Automatic Defluxing System and Cleanliness Tester

The Trident automatic defluxing system has specific throughput rates determined by board size. The system is capable of defluxing and cleanliness testing up to 200 101 × 152 mm boards and up to 28 457 × 508 mm boards per hour. The system offers several defluxing configurations designed to provide complete compatibility with all defluxing requirements. The process consists of up to five cycles: prewash, wash, rinse, cleanliness testing, and drying. Prewash may consist of a steam soak, high-pressure DI water spray, or chemical spray and soak. The wash cycle uses environmentally responsible defluxing solutions, neutralizing and solublizing flux and other residues. The rinse cycle is controlled by the built-in cleanliness tester in which rinse cycles are added or subtracted from the process automatically. The dry cycle uses a combination of radiant and convection heat for rapid, thorough drying. Equipped with an automatic chemical management system that automatically measures and doses concentrated defluxing chemicals into the wash-solution recirculation system, the wash solution is captured and reused, eliminating routine chemical discharge. Level gauges indicate the available levels of wash solution and concentrated chemical. Trident is also equipped with an inverse-mounted vertically oriented spray pump that virtually eliminates pump-caused dragout. Built-in statistical process control (SPC) data capturing technology allows users to view historical SPC data, including actual cleanliness results, at the machine and remotely.
The Zero-Ion ionic contamination (IC) cleanliness tester automatically removes and detects contamination on an electrical assembly or bare board and provides quantitative contamination measurements. The Zero-Ion uses a dynamic technology that provides automatic regeneration of the machine’s test solution, maintaining a high degree of test solution sensitivity. The Zero-Ion meets the requirements of military and commercial cleanliness testing standards including MIL 2000A, IPC test method 001, MIL-C-28809, MIL-P-55110 and IPC TM650-2.3.26. It has been reviewed by the U.S. Naval Air Weapons Center and determined to be the most sensitive ionic contamination tester available, 3.7× more sensitive than the manual resistivity of solvent extract (R.O.S.E.) test. The Zero-Ion performs cleanliness tests automatically and is capable of storing 50 test parameters within its internal controller. When connected to a PC, it can store virtually unlimited quantities of testing parameters and comes with built-in printer to record results. Aqueous Technologies Corp., A2.599.

Automated Handler for Flashstream Technology

Flashstream automated programming technology, the 3000FS, is designed to solve excessive programming times in current in-system, JTAG and in-circuit programming production methods, the 3000FS is modeled from the current BPM 3710 handler and contains four Flashstream programming sites. Rated at 1100 devices per hour, the new 3000FS is flexible enough to handle parts in tray, tube or tape for device input or output. Combining these two technologies gives the 3000FS automated flash programmer the ability to produce a fully programmed 512Mb NAND Flash memory device every 3.4 seconds or 1100 devices in an hour. Flashstream technology uses a proprietary co-processor technology, Vector Engine, to hardware-accelerate flash memory waveforms during the programming cycle. Faster speeds are achieved through synchronous operations that eliminate the dead times when the DUT waits on the programmer. BPM Microsystems, with distributor PB Tec, A2.377.

High-purity Solders and Alloys

Showcasing lead-free and tin/lead alloys, the team will be on hand during the event to offer expertise and product and application advice. The company is the U.K. producer of the SN100C solder alloy from Nihon Superior. It also supplies the Cobar product range, with Cobar representatives also available during the show. The Cobar product range includes solders, liquid fluxes, thinners, rework fluxes, cleaning agents, peelable soldermask, cobrush flux applicators, and solder pastes and cored solder wires. DKL Metals Ltd., A4.570.

AOI and SPI Systems, X-ray Inspection, and Software

The MV-7xi in-line AOI system is configured to provide one high-resolution color digital top-down camera and four of the same fitted as side-view cameras. The Quad Angle Lighting System provides four independently programmable zones for optimal illumination of inspection areas. The MV-7xi demonstrated will feature a 2D camera bar code reader, a high-throughput three-stage PCB conveyor, and a PCB under-board support system. This system will also be configured with the Intelli-Scan Laser System for lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability. A comprehensive Package Type Library provides simple “Drag and Drop” component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.
The MV-3L five-camera desktop AOI system will be displayed with one high-resolution color digital top-down camera and four more as side-view cameras, as well as the Intelli-Beam Laser System. The system can measure the Z-axis of a given region of interest.
The MS-11 in-line SPI system uses Shadow Moiré technology and phase stepping image processing to inspect solder paste deposition on PCBs post screen print.  The MS-11 detects insufficient solder, excessive solder, shape deformity, shift of deposition, and bridging. Its two megapixel camera system enhances image quality and accuracy.
The X-Scope 2000 X-ray system features true 5 µm focal spot size, 130 kV real-time 1280 × 1024 output, 125× geometric magnification, 600× optical magnification with CNC capability.
A total quality management system software, Intellisys promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies. Intellisys also provides remote debugging and monitoring of up to 8 production lines. Typical programming time is under one hour per assembly. The standard SPC software package promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies.  MIRTEC, A2.377.

Spectrum Thermal Process Optimization Software

For increased solar cell efficiencies, the Spectrum thermal process optimization software automatically identifies the correct furnace set up that achieves a thermal profile that is positioned within the sweet spot of the established process window for solar cell manufacturing. The Spectrum is a software-only option for the SunKIC profiler. KIC, with GS Electronics, B3.136.

Reflow Oven Optimization

The Navigator Power software has proven to reduce electricity use in reflow ovens by up to 15%. It enables users to search on oven recipes (zone temperatures and conveyor speed) that position the thermal process deep in spec while allowing the reflow oven to run at the lowest possible consumption of electricity. Third-party research has verified the ability of the Navigator Power to reduce energy consumption while maintaining product quality on all reflow ovens in the factory. KIC, A4.570.

RF Matrices

This range of scalable RF matrix switching solutions with LXI-compliant Ethernet control uses an innovative construction that allows Pickering Interfaces to create almost cable-free RF matrices in 50 and 75 ? with frequency coverage up to 3 GHz. The first product introductions are 32×16 and 32×8, and the construction methods used allow the creation of a wide range of other matrix sizes. The product family targets more affordable and flexible RF matrix switching. Pickering Interfaces, A1.344.

Test System

The V8 flying probe test system has a vertical architecture that enables high-speed, high-precision probing on both sides of the UUT simultaneously, offering the maximum in test coverage and flexibility in a compact, ergonomic package. It is equipped with eight electrical flying test probes (four on each side), two Openfix capacitive and two power flying probes, plus two CCD cameras (one on each side). With 14 mobile resources available to test the UUT, Pilot V8 has a range of in-circuit and functional test capabilities. In addition, like other Seica flying probe solutions, the Pilot V8 can implement a series of net-oriented measurement techniques based on measurements executed on the board signal nets. These new test methods cut the time required for in-circuit test by lowering the number of measurements required, maintaining the same level of fault coverage and valuable diagnostic information. The mobile power probes are another innovation that enable UUT power-up without additional fixed cables. Pilot V8 can also execute parallel tests on two UUTs. Seica, A1.548 and B2.125.

Selective Soldering System

Based on the VIVA Integrated Platform, the Firefly laser selective soldering system offers a three-step process for generating, verifying and running a soldering program, as well as other software tools that can improve system flexibility and performance. The integrated temperature-control system provides feedback during the soldering process with a real-time, on-screen display of thermal profiles. Seica, A1.548 and B2.125.

Pick-and-Place Capacity Variation

True Capacity on Demand for the high-volume A-Series can save 20% of initial capital costs. True Capacity on Demand (TCoD) solves the problem of seasonal production fluctuations. Customers buy only the base pick & place capacity they need, and simply rent extra pick-and-place heads from Assembléon to meet peak demand. The modular design of A-Series pick & place machines means there is no change to the equipment footprint. The calibration-free robots are fitted to the machines on the line with no need to change internal hardware. The machines offer high first pass yield (FPY) and low cost of placement (including energy consumption). A new tray trolley for the AX-201 uses a caching system to double the feeding speed. Assembléon, A2.477.

Screen Printer & Placement Combo

Targeting high mix, medium volume production, an MC-P screen printer will be demonstrated with the MC-5 and MC-8 pick & place machines. The MC-P screen printer has a servo-driven squeegee with variable attack angle to improve solder filling levels. It varies the blade contact angle on-the-fly via software for consistently flat and uniform solder deposits, even when mixing large and small components. The MC-5 is a new generation high-speed chip mounter with a speed of 24,000 CPH on a 1.25-m-long footprint. It has 118 tape feeding positions. The MC-8 has up to 119 feeders, and places chips, ICs, and odd-form components. It places up to 8.9k components per hour with an accuracy of 30 µm for ICs and QFPs. Precision force control places press-fit through-hole connectors with insertion forces up to 30 N. Assembléon, A2.477.

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