April 7, 2011 -- Adhesives Research (AR), custom pressure-sensitive adhesive tapes (PSA), specialty coating, film and laminate developer and manufacturer, launched multiple bonding technologies for bus bar, solar cell junction box, and encapsulation barrier applications in crystalline silicon and thin film photovoltaic (PV) modules.
As an alternative to traditional bonding methods, such as soldering for electrical interconnects and liquid epoxies for encapsulation, the new PSA technologies offer PV manufacturers reliable bonds that deliver added functionality for enhancing the capabilities and performance of a variety of PV modules. PSA tapes reportedly enable easier handling in continuous roll formats without messy clean-up.
For solar cell junction box applications, ARclad 92446 and ARclad 92709 are the next-generation high-performance junction box tapes combining adhesive and foam technologies. AR's die-cuttable foam tape technology is laminated to the junction box, creating a long-term bond directly to the glass. AR claims that this PSA outperforms other bonding products in accelerated aging and damp heat tests. It has high temperature performance up to 120ºC, heat- and moisture-resistance, and adhesion to various substrates (glass, metal, TPT and select fluorocarbon films). The closed cell 1/25" (40mil or 1mm) foam has a double-faced construction, with a 2mil (50µm) clear polyester release liner. Target UL746C on TPT film and polycarbonate.
For use in flexible thin film PV modules, Adhesives Research's barrier technology forms strong, flexible bonds while providing moisture and oxygen barrier properties required for dependable encapsulation. An alternative to liquid encapsulating materials, AR's PSA claims less mess, ease-of-handling and more rapid throughput. A benign, low-outgassing, non-corrosive and electrically clean adhesive, this PSA becomes active at 100ºC. It boasts high clarity with low color, and is UV-resistant. The product can be used with rigid and flexible cells.
ARclad 92708 conductive PSA bus bar technology is supported by a tin-coated copper foil carrier. Featuring the homogenous conductive adhesive technology used in Adhesives Research's PSA ARclad 90038, ARclad 92708 forms stable conductive bonds to electrical contact points under a wide range of environmental conditions. The 1oz., single-face foil, coated with 1mil of enhanced, highly conductive acrylic adhesive, enables ARclad 92708 to offers a firm, cohesive, electrically conductive bond that reduces micro movement while withstanding thermal cycling and elevated damp heat conditions. It features reduced T-joint resistance, joint stability in hot ampacity testing (10 amps, 120ºC, 6-days), strong thermal shock performance (IEC 61646, -40–85ºC), and stable damp heat resistance (85ºC/85% RH).
Adhesives Research offers adhesive polymerization, mixing, adhesive coating and release liner design supported by extensive product development and analytical support. The company's pressure-sensitive adhesives are used in electronics, displays, wireless telecommunications, window fabrication, and the pulp and paper industry, as well as in medical diagnostics and devices, wound care and pharmaceuticals/transdermals. Learn more at www.adhesivesresearch.com.