Henkel conductive die attach film debuts for thin die in advanced packages - Advanced Packaging
This article is from

Henkel conductive die attach film debuts for thin die in advanced packages

March 28, 2011 -- Henkel Electronics released its Ablestik C100 series conductive die attach films. Available in two formulations -- Ablestik C130 and Ablestik C115 supplied in 30 micron and 15 micron thicknesses, respectively -- the conductive die attach films eliminate, protect thinner die during attach, and facilite greater bondline control than traditional die attach pastes, says Henkel.

Ablestik C100 series film die attach materials workability has been established on die sizes ranging from 1 x 1mm up to 6 x 6mm for a variety of package types including both QFNs and QFPs. The materials' better wetting ability with lower bonding temperature provides stable adhesion strength, allowing robust adhesion against moisture and MSL Level 2 performance on all leadframe surface finishes.

Die attach film provides process control and reliability, especially with thinner wafers, said Kevin Becker, Henkel director of product development for film die attach adhesives, adding that these advantages are now available for conductive as well as nonconductive processes.

Henkel operates worldwide with brands and technologies in three business areas: Laundry & Home Care, Cosmetics/Toiletries, and Adhesive Technologies. For more information on Henkel's Ablestik C130 or Ablestik C115, visit www.henkel.com/electronics

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group