TSV electroplating dev team unites SVTC, Amerimade Technology, Shanghai Sinyang Semiconductor Materials

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October 19, 2011 -- Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for through-silicon via (TSV) that are production-ready for advanced packages and micro electro mechanical systems (MEMS).

By combining a commercialization specialist with tool and materials providers, this partnership will be able to develop new electroplated film processes for TSV in over 95,000 square feet of state-of-the-art cleanroom, staffed 24/7 with SVTC's engineering team, electroplating toolsets from Amerimade, and chemical formulae from Shanghai Sinyang.

The aim is a commercially viable process for electroplating through-silicon via interconnects that can be ramped up to volume production at advanced packaging houses, semiconductor manufacturers, and MEMS fabrication and packaging facilities.

Shanghai Sinyang Semiconductor Materials Co. Ltd. provides research and development, design, and manufacturing of advanced chemicals for the electronics industry, specifically for semiconductor manufacturing, packaging test and assembly, solar cell manufacturing, and avionics. More information can be found at www.sinyang.com.cn.

Amerimade Technology Inc. designs, manufactures and provides long-term field support for wet chemical processing systems. More information can be found at www.amerimade.com.

SVTC Technologies provides development and commercialization services for innovative semiconductor process-based technologies and products, cost effectively and in an IP-secure manner. More information can be found at www.svtc.com.

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