IC packaging report covers 12 package types + bare die, SATS providers - Advanced Packaging
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IC packaging report covers 12 package types + bare die, SATS providers


April 28, 2011 -- New Venture Research will release "The Worldwide IC Packaging Market, 2011 Edition" in May 2011. It offers an in-depth look at the worldwide integrated circuit (IC) packaging market.

The forecasts of individual IC device markets are provided, for units, revenue, and ASP, from 2008 through 2014.

The packages for each of these markets are then forecast, broken down into I/O ranges.

In a separate chapter, the package types are rolled up to deliver an overall worldwide forecast of IC packages, divided into 12 different package families, plus bare die solutions. The major package families include:

  • Dual in-line package (DIP);
  • Small outline transistor (SOT);
  • Small outline (SO);
  • Thin small outline package (TSOP);
  • Dual flat pack no lead (DFN);
  • Chip carrier (CC);
  • Quad flat pack (QFP);
  • Quad flat pack no lead (QFN);
  • Pin grid array (PGA);
  • Ball grid array (BGA);
  • Fine-pitched ball grid array (FBGA);
  • Wafer-level package (WLP).

Additional unit forecasts cover die-mounting using direct chip attach (DCA) methods:

  • Chip on board (COB);
  • Flip chip on board (FCOB);
  • Chip on glass (COG);
  • Flip chip on glass (FCOG);
  • And tape automated bonding (TAB)/tape carrier package (TCP).

Packaging revenue is generated by multiplying worldwide units with pricing information supplied by the contractor IC package assemblers.

The contract IC packaging market is forecast and supplied in a separate chapter. Units and revenue are analyzed by package family. Forecasts are computed by compiling information obtained from each individual contract assembly company. Pricing information is provided by I/O count and price per I/O and, when multiplied by units, yields revenue. Profiles of individual contract IC package assemblers are also provided, as is a chapter on the state of the industry. 

The purpose of the report is to aid companies associated with the IC packaging market in forecasting demand for their own products. IC packaging demand is affected by changes in the die, and by performance expectations of the final product purchased at the consumer level.

For more information, see www.newventureresearch.com.

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