Silicon interposers, embedded capacitors subject of ALLVIA presentation at IMAPS Device Packaging - Advanced Packaging
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Silicon interposers, embedded capacitors subject of ALLVIA presentation at IMAPS Device Packaging

March 2, 2011 - Marketwire -- ALLVIA, through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present "Silicon Interposers Enable High Performance Capacitors."

The data presented in this paper will show that, after several thermal cycles, planar capacitors on silicon result in stable, reliable capacitors operating at very high frequencies. Planar capacitors in interposers don't exhibit parallel resonance, an issue seen with chip capacitors. ALLVIA, on behalf of its foundry customers, has been conducting studies of various capacitors on silicon interposers.

Thin film capacitors without TSVs have been used previously. However, with high interconnect inductance, benefits of thin film capacitors have not been fully realized. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs provide very low inductance interconnects, enabling high electrical performance when integrated with embedded thin film capacitors.

ALLVIA has integrated embedded capacitors on silicon interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. 3D integration with ALLVIA's through silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance.

The International Microelectronics And Packaging Society (IMAPS) is the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. IMAPS Device Packaging conference will be held at the Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ, March 8-10, 2011.

ALLVIA is a through silicon via (TSV) foundry offering prototyping and full volume production of both front side and back side TSVs to the MEMS and semiconductor industries as well as silicon etching, copper plating, photolithography, CMP, etc.

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