BOE Technology Group and Applied Materials to deliver leading-edge display technologies

BOE Technology Group announced that it has placed significant orders for advanced Gen 8.5 and Gen 5.5 display production equipment from Applied Materials for use in multiple facilities. BOE selected these systems because of their ability to produce faster, smaller thin film transistors for the next era of high definition televisions and high pixel density displays for future mobile devices. Applied Materials is providing a full suite of advanced deposition equipment including the leading-edge Applied  PiVot PVD  and PECVD systems, which are capable of supporting critical new technologies such as metal oxide and LTPS.

"BOE continues to execute on its manufacturing capacity and technology initiatives and appreciates the strong cooperative relationship with Applied Materials in developing and creating value in support of the world's largest TV and mobile display market," said Mr. Liu Xiaodong, executive vice president, chief operation officer of BOE. "Over the past year we have achieved key high-volume Gen 8.5 production and yield milestones, which demonstrate our leadership in growing this strategic industry in China. We are pleased to work with Applied Materials to implement the new technologies needed to continue meeting the high quality, high performance screens consumers have come to expect and demand."

"Applied Materials is delighted to play an important role in BOE's growth strategy and is committed to providing the leading-edge technologies to enable its continued success," said Ali Salehpour, group vice president, general manager, Applied Materials Energy and Environmental Solutions and Display Business Group. "There is a major shift taking place in the display industry toward adopting new materials, and BOE selecting Applied Materials equipment validates the technology differentiation and productivity gains we provide to our customers. Together, BOE and Applied are enabling consumers to experience displays with world-class color, clarity and brightness."

The Applied PiVot PVD and PECVD systems selected by BOE provide a high-performance, cost-effective path to manufacturing stunning high resolution amorphous silicon, metal oxide and LTPS displays.  These systems can significantly increase production and achieve the same economies of scale that enabled the cost of LCD TVs to fall by more than 95 percent over the past decade and brought large-area LCD televisions within the reach of billions of consumers around the globe.

Applied Materials, Inc. provides equipment, services and software to enable the manufacture of advanced semiconductor, flat panel display and solar photovoltaic products. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world.

Font Sizes:

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.


VIDEOS

Electroiq 2 EIQ2

NEW PRODUCTS

ROFIN presents turnkey solutions for FEOL applications

July 2, 2013 The new laser wafer processing system Waferlase 200/300/450, is a fully automated modular platform comprising a market-leading ...

EV Group launches new LowTemp room temperature debonding platform

July 1, 2013 EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today i...

All-in-one microscope for advanced imaging, recording and measurement

June 7, 2013

Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope.

Olympus launches LEXT OLS4100 laser confocal microscope

June 7, 2013

New 3D measuring system offers auto brightness and high-speed stitching.


TECHNOLOGY PAPERS

Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...

WEBCASTS

Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...

BLOGS

IFTLE 153 IMAPS DPC part 3 Leti, Dow, STATSChipPAC

Wed Jul 03 16:25:00 CDT 2013

IFTLE 152 2013 IMAPS Device Packaging Conference part 2

Sat Jun 22 16:04:00 CDT 2013

IFTLE 151 2013 IMAPS Device Packaging Conf part 1 - Amkor

Sun Jun 16 11:30:00 CDT 2013

IFTLE 150 ICEP Osaka part 1

Mon Jun 10 10:22:00 CDT 2013

IFTLE 149 2013 ECTC part 1

Tue Jun 04 09:45:00 CDT 2013

Tackling Design for Yield Questions at DAC

Wed May 22 15:39:00 CDT 2013

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012

SUBSCRIBE

LATEST ISSUE

Volume 56, Issue 4

Article Archive for Solid State Technology.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS