China WLCSP established R&D subsidiary in CA - Advanced Packaging
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China WLCSP established R&D; subsidiary in CA

(January 10, 2011 - BUSINESS WIRE) -- China WLCSP Co. Ltd., provider of wafer level (WLP) miniaturization technologies for the electronics industry, confirmed its commitment to the US market with the opening of a new R&D center in Sunnyvale, CA.

The R&D center will support China WLCSP's regional activities with OEMs and industry partners in the growing mobile handset market.

"The US is a strategic market, which experiencing solid growth in the high-end mobile device market," said Wang Wei, CEO of China WLCSP. "We have several important customers and partners in the US, where we plan to play a leading role over the next few years."

China WLCSP is a leading provider of wafer level miniaturization technologies and processes for the electronics industry. China WLCSP enables new levels of miniaturization and performance by applying its unique expertise in the electrical, thermal and mechanical properties of materials and interconnect. As a result, China WLCSP’s technologies are widely adopted in high-growth markets including consumer, computing, communications and medical. China WLCSP is headquartered in Suzhou, China. Learn more at

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