One-piece jetting cartridge for semiconductor packaging inspired by ink jet designs

April 25, 2012 -- Nordson ASYMTEK, a fluid dispensing, coating, and jetting technology supplier, uncrated the NexJet System for jetting, with a newly designed jet cartridge and new software control for semiconductor packaging applications such as flip chip underfill, chip scale packages (CSP), ball grid arrays (BGA), package-on-package (PoP) underfill, precise coating, and adhesive dispensing.

The Genius Jet Cartridge one-piece jet is quickly and easily removed without tools, much like an ink jet cartridge. The cartridge dispenses up to 50 million cycles before a replacement is necessary, depending upon the application. It has built-in memory to store usage data like the number of cycles and cartridge type, which is communicated to the jetting tool and compared to the recipe for process control.

The NexJet System’s precision software control enables jetting of low- and high-viscosity fluids, and accommodates a broad range of fluids.

Cost of ownership is up to 20% less than with other jets, Asymtek reports.

Each NexJet System ships with two Genius Jet Cartridges and a specially designed Genius Jet Cartridge Cleaning Tool that completely flushes the jet cartridge while the other jet cartridge can be used for production. The NexJet system is available as an upgrade for Nordson ASYMTEK's Spectrum, Axiom, and DispenseMate Series platforms, and can accommodate six reservoir sizes: 3 cc, 5 cc, 10 cc, 30 cc, 2.5 oz, and 6 oz. The Genius Jet Cartridge comes in 4 sizes.

Nordson ASYMTEK makes precision automated fluid dispensing, conformal coating, and jetting systems for semiconductor packaging, printed circuit boards, LEDs, flat panel displays, medical and biotechnical devices, and solar and photovoltaic production. For more information, visit www.NordsonASYMTEK.com. Nordson Corporation (Nasdaq:NDSN) engineers, manufactures and markets differentiated products and systems used for dispensing adhesives, coatings, sealants, biomaterials and other materials, fluid management, testing and inspection, and UV curing and surface plasma treatment.

 Visit the Advanced Packaging Channel of Solid State Technology, and sign up for our Advanced Packaging News e-newsletter!

MOST READ



05/03/2012
Volume 55, Issue 4

Article Archive for Advanced Packaging.

SUBSCRIBE

© 2012. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS