Clarkson U tallies $1.4M support from Intel over decade - Advanced Packaging
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Clarkson U tallies $1.4M support from Intel over decade


February 4, 2011 -- During the past ten years, Clarkson University has received more than $1.4 million of direct and indirect (through Semiconductor Research Corporation) funding from Intel Corporation.

Intel donated silicon wafer polishing equipment and provided the funding to support research in the area of chemical-mechanical planarization (CMP) to Professors S.V. Babu, Egon Matijevic, and Dipankar Roy, and in nanoparticle detachment to Prof. Cetin Cetinkaya.

The money also supported many graduate and undergraduate researchers, and led to the hiring of 12 Clarkson Ph.D. graduates in recent years.

Intel is a global leader in silicon innovation and the world’s largest manufacturer of microprocessors. Learn more at www.intel.com

Located just outside the Adirondack Park in Potsdam, N.Y., Clarkson is a nationally recognized research university for undergraduates in engineering, business, arts, sciences and health sciences. Learn more at www.clarkson.edu

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