CEA-Leti deploys EVG's litho, packaging tools for 300mm line - Advanced Packaging
This article is from

CEA-Leti deploys EVG's litho, packaging tools for 300mm line

April 19, 2011 - PRNewswire -- Research center CEA-Leti (Grenoble, France), has installed multiple EVG tools in its industry-first 300-mm cleanroom dedicated to R&D and prototyping for 3D integration applications. While Leti's facility is focused on R&D and prototyping, EVG's equipment will be leveraged with an eye toward widespread adoption of 3D technology for high-volume applications. 

EVG's equipment will be used in 3D technology demonstrations for Leti's global customer base, as well as low-volume pilot production on 300mm wafers, aiming to transfer the processes to Leti's industrial partners' high-volume manufacturing environments.  

EVG systems to be deployed on CEA-Leti's new 300mm 3D line:

  • IQ Aligner production mask alignment system
  • SmartView NT highest precision bond alignment system
  • EVG560 production wafer bonding system
  • EVG850 production bonding system for direct wafer bonding.

These lithography and packaging systems were specifically chosen for the advantages they deliver in 3D semiconductor package processing. CEA-Leti will be able to tap EVG's extensive process know-how in 3D integration and through silicon via (TSV) manufacturing, as the institute's 3D offerings include TSVs along with advanced capabilities in alignment, bonding, thinning and interconnects.

Paul Lindner, EV Group's executive technology director, said, "Our longstanding partnership with CEA-Leti has yielded significant advances for both companies as we have collaborated on new developments and leveraged each other's capabilities." Selecting EVG's 300mm thermo compression wafer bonder and other tools will help CEA-Leti drive 3D technology advancement, Lindner added.

EVG works with research consortia and institutions such as CEA-Leti, as well as global consortia, including EMC-3D (which focuses on lowering the overall cost of 3D chips), SEMI, NILCOM (Consortium for Commercialization of Nanoimprint Lithography), NIL Austria, and Mancef (Micro and Nanotechnology Commercialization Education Foundation). EVG provides lithography and nanoimprint lithography, and other wafer processing and inspection tools for 3D integration technology advancements, semiconductor fab, MEMS, and nanotechnology. Learn more at www.evgroup.com.

CEA is a French research and technology public organization, with activities in four main areas: energy, information technologies, healthcare technologies and defence and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. For more information, visit www.leti.fr.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group