C2MI's 3D MEMS fab adds Akrion Systems' advanced wet stations - Advanced Packaging
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C2MI's 3D MEMS fab adds Akrion Systems' advanced wet stations


April 27, 2011 -- The MiQro Innovation Collaborative Centre (C2MI) will purchase three Akrion Systems GAMA automated wet process systems for the development and manufacture of advanced devices at C2MI's state-of-the-art MEMS facility in Bromont Technoparc, Quebec, Canada.

The GAMA systems will be used for all of the wet processing requirements of the Centre. The systems will include Akrion Systems' proprietary technologies for drying MEMS wafers with deep feature sizes and for controlling silicon etch kinetics.

Various MEMS and 3D wafer-level integration strategies using through-silicon via (TSV) require various wafer bonding preparation steps and bulk micromachining processes," said Luc Ouellet, vice president of technology development of Teledyne DALSA Semiconductor. "These three highly automated tools provide SMIF-based dry-in and dry-out interfaces to operators, thus reducing the risks to humans, ensure a technically sound solution to basic physical limitations of high aspect ratio TSV, allow various environmentally friendly process schemes and reduce the overall operation costs with responsible chemicals and de-ionized water utilization. We are also very pleased with the automated chemical delivery, real-time composition analysis and real time micro-contamination monitoring provided by the various integrated sub-systems of these three GAMA wet processors."

Also read: CMOS, MEMS meld enabled with advanced TSV, flexible interconnects

Akrion Systems provides advanced surface preparation process solutions and systems, including single-wafer and batch-immersion cleaning tools for the microelectronic, display and photovoltaic industries. For further information, please visit the Akrion Systems web site: http://www.akrionsystems.com.

The MiQro Innovation Collaborative Centre (C2MI) is an original partnership between Université de Sherbrooke, Teledyne DALSA Inc. and IBM Canada Ltd, Bromont Plant. The C2MI will be an international pioneer in packaging the next generation of microchips. Visit www.c2mi.ca to learn more.

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